Abstract: The present invention provides a backlight module, a display device, and a backlight module manufacturing method. The backlight module includes a reinforcing plate, a back adhesive, a plurality of light boards spliced with one another, and a fluorescent film. Back adhesive splicing gaps in the back adhesive are staggered with light board splicing gaps. The backlight module manufacturing method includes steps as follows: providing a reinforcing plate; manufacturing a back adhesive on the reinforcing plate; splicing a plurality of light boards on the back adhesive; and manufacturing a fluorescent film on the light boards.

Abstract: Embodiments of this disclosure disclose an uplink signal transmission method, which comprises: reserving, by a first terminal, a first time interval on an uplink data transmission channel, where the first terminal does not send uplink data within the first time interval, the first time interval is used by a second terminal to perform channel listening before sending a random access preamble, and the first time interval is determined by using one or more of the following parameters: a start moment at which the uplink data transmission channel arrives at a network device, an end moment at which the uplink data transmission channel arrives at the network device, a start moment at which the second terminal performs the channel listening, an end moment at which the second terminal performs the channel listening, duration in which the second terminal performs the channel listening, or an uplink timing advance of the first terminal.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a method for forming a 3D memory device is disclosed. A stop layer, a first polysilicon layer, a sacrificial layer, a second polysilicon layer, and a dielectric stack are sequentially formed at a first side of a substrate. A channel structure extending vertically through the dielectric stack, the second polysilicon layer, the sacrificial layer, and the first polysilicon layer, stopping at the stop layer, is formed. An opening extending vertically through the dielectric stack and the second polysilicon layer, stopping at the sacrificial layer to expose part of the sacrificial layer, is formed. The sacrificial layer is replaced, through the opening, with a third polysilicon layer between the first and second polysilicon layers. The substrate is removed from a second side opposite to the first side of the substrate, stopping at the stop layer.

Abstract: A virtual SIM card acquisition method, including: using a first SIM card to register a wireless network and establishing a connection with a server through a packet data service of the wireless network; sending a virtual SIM card acquisition request to the server based on the connection between the subscriber terminal and the server; receiving the virtual SIM card data sent from the server and acquiring connectable carrier information of the virtual SIM card; and sending the virtual SIM card acquisition request to the server again if the connectable carrier information of the virtual SIM card is inconsistent with the carrier information of the roaming area of the first SIM card, and completing acquisition of the virtual SIM card when the connectable carrier information of the virtual SIM card is consistent with the carrier information of the roaming area of the first SIM card.

Abstract: The disclosure provides a method for commenting on a multimedia resource, a related electronic device and a storage medium. In response to a comment trigger operation on a multimedia resource, the electronic device obtains an emoticons corresponding to the multimedia resource and displays the emoticons to enable a user account to comment on the multimedia resource.

Abstract: An array substrate and a manufacturing method thereof are disclosed. The method includes: forming a first thin film transistor which includes a first semiconductor layer, a first gate electrode, a first drain electrode and a first source electrode; forming a second thin film transistor which includes a second semiconductor layer, a second gate electrode, a second drain electrode and a second source electrode; and forming a dielectric layer which spaces the first semiconductor layer apart from the second semiconductor layer; the method further includes: processing the same layer to form at least one selected from the group consisting of the first gate electrode, the first drain electrode and the first source electrode, at least one selected from the group consisting of the second gate electrode, the second drain electrode and the second source electrode, and the dielectric layer by the same layer.

Abstract: A display panel and a display device are provided. The display panel includes a display region and a sensor region. The sensor region is provided with multiple sensors in the display panel. Multiple first pixels are arranged in the display region. The first pixels are arranged as a first array in the display region. Multiple second pixels are arranged in the sensor region, and the second pixels are arranged as a second array in the sensor region. A pixel unit area of the first array is equal to a pixel unit area of the second array, and the pixel unit area is a number of the pixels multiplied by an area of each pixel in a unit area. The display device includes the display panel and the sensors. The sensors are disposed on one side of the display panel.

Abstract: One or more implementations of the present specification provide a method and apparatus for securely entering a trusted execution environment in a hyper-threading scenario. The method can include: in response to that a logical processor running on a physical processor core generates a trusted execution environment entry event through an approach provided by a virtual machine monitor, labeling the logical processor with a state of expecting to enter a trusted execution environment; and in response to determining that all logical processors corresponding to the physical processor core are labeled with the state of expecting to enter a trusted execution environment, separately controlling each one of the logical processors to enter a trusted execution environment built on the physical processor core.

Abstract: Embodiments provide an optical coupling apparatus, an optical module, and a communications device. In those embodiments, the optical coupling apparatus includes: an optical fiber component, including a plurality of optical fibers and an optical fiber fixing block. The plurality of optical fibers are fixed to the optical fiber fixing block. A first end face is disposed on the optical fiber fixing block. At least some of the optical fibers include plug ends which protrude from the first end face. An optical write waveguide block, including a main body and a plurality of waveguides disposed in the main body. A second end face is disposed on the main body, coupling holes that are in a one-to-one correspondence with the plug ends are disposed on the second end face in a recessed manner, and the coupling holes are formed when ends of the waveguides are recessed from the second end face.

Abstract: The quality of encoded signals can be improved by reclassifying AUDIO signals carrying non-speech data as VOICE signals when periodicity parameters of the signal satisfy one or more criteria. In some embodiments, only low or medium bit rate signals are considered for re-classification. The periodicity parameters can include any characteristic or set of characteristics indicative of periodicity. For example, the periodicity parameter may include pitch differences between subframes in the audio signal, a normalized pitch correlation for one or more subframes, an average normalized pitch correlation for the audio signal, or combinations thereof. Audio signals which are re-classified as VOICED signals may be encoded in the time-domain, while audio signals that remain classified as AUDIO signals may be encoded in the frequency-domain.

Abstract: Methods, apparatuses and electronic devices for testing a memory of a chip are provided. Specifically, the chip includes a plurality of operation modules, the operation module includes at least one operation unit, and the operation unit includes at least one memory. The method includes generating a first test vector for a first operation module of the operation modules, and testing the memory in the first operation module by using the generated first test vector independent of other operation modules of plurality of operation modules, where the other operation modules are different from the first operation module.

Abstract: The present invention provides a pixel structure and a liquid crystal display panel. The pixel structure includes a plurality of sub-pixels and a plurality of pixel electrodes, wherein a boundary of each of the sub-pixels has a hexagonal shape, each of the pixel electrodes includes at least three main electrodes disposed to intersect each other, all of the main electrodes intersect each other at an intersection, and the main electrodes define an area in each of the sub-pixels as a plurality of domains that are independent from each other.

Abstract: This application provides a network configuration method, a device, and a system. The method implemented by a primary device includes: obtaining a configuration template file based on a type of a to-be-configured network device, where the configuration template file corresponds to a network device of a same type and includes at least one configuration command indicating a relationship between a configuration parameter of the to-be-configured network device and a configuration parameter of another network device; generating instantiated configuration data of the to-be-configured network device based on the configuration parameter and the at least one configuration command; and sending the instantiated configuration data to the to-be-configured network device, where the instantiated configuration data is used to instruct the to-be-configured network device to perform configuration based on the instantiated configuration data, to implement configuration automation.

Abstract: An adhesive, a display panel and a manufacturing method thereof, and a display device are provided. The adhesive includes a base bonding material and a light-shielding particle, and the light-shielding particle includes a degradable coating layer and a light-shielding material wrapped by the degradable coating layer.

Abstract: A compensation method and a compensation apparatus for an organic light-emitting display, and a display device are disclosed. The compensation method includes: determining a write-back voltage of each sub-pixel to be compensated in a row to be compensated in a current frame according to a data voltage and a gain value of the sub-pixel to be compensated in the row to be compensated in the current frame, the gain value being greater than 1; and respectively writing back the write-back voltage of each sub-pixel to be compensated in the row to be compensated in the current frame correspondingly to the sub-pixel to be compensated in the row to be compensated in scan time of a blank period of the current frame.

Abstract: A positioning method includes calculating, based on data that is of collection points at a road edge and that is collected by a radar, a feature of a road on which a terminal device is actually located, determining, from a plurality of candidate roads based on the feature of the road on which the terminal device is actually located and features of the plurality of candidate roads, a target road matching original positioning coordinates of the terminal device, and correcting the original positioning coordinates using the target road, to obtain corrected positioning coordinates.