Abstract: A silver-glass composition for use in attaching a semiconductor support and a method for making the attachment are disclosed. The glass component of the composition is a low melting point glass comprising about 75-85 wt. % lead oxide, about 8-15% boron oxide, about 0.75 to 2.5 wt. % silicon-dioxide, 0-10 wt. % zinc oxide, 0 to 3 wt. % alumina, 0.5 to 5.5 wt. % cuprousoxide and a non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1.0:0.25 to 1.0:10. The weight ratio of silver to glass in the composition is in the range about 2:1 to 9:1.

Abstract: A method for making perforations or forming depressions in a glass work piece is described. Pursuant to the method, a two piece housing for the work piece is provided. The housing when assembled has a cavity conforming in size and shape to the work piece. The lower housing piece has a continuous upper surface and the upper housing piece has a smooth lower surface and openings in the housing piece conforming in size and position to the perforations or depressions desired to be made in the work piece. The work piece is enclosed in the housing and then plugs are inserted in the openings in the upper housing piece. The plugs snugly fit the openings and extend above the upper surface of the upper housing piece. A weight is then disposed on the upper surface of the plugs. The weight may be a flat metal sheet and is of sufficient weight to cause the plugs to exert a pressure of at least about one half pound per square inch on the work piece.

Abstract: Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, up to 5% by weight bismuth oxide and from 0.1 to 5.0% alumina are disclosed. These glasses are mixed with particulate lead titanate in amounts up to about 56% by volume. These mixtures have very low coefficients of thermal expansion and are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.

Abstract: Lead borate and lead zinc borate glasses containing from 0.1 to 10% by weight cuprous oxide (Cu.sub.2 O) and fluoride, the molar ratio of cuprous oxide to fluoride being in the range 1:0.25 to 1:10, preferably in the range 1:1 to 1:5, and up to 5% by weight bismuth oxide. These glasses may be mixed with particulate refractory fillers in amounts up to about 56% by volume. The sealing glasses are useful for bonding ceramic, glass and metal parts together at low temperatures. They are especially useful as semiconductor package sealants.

Abstract: Sealed semiconductor packages and the like and a method of making them are described. The sealant compositions employed are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boran glasses in which the zinc-lead mol ratio is below 1:2.

Abstract: Sealing compositions suitable for sealing semi-conductor packages and the like at temperatures below about 450.degree.C. The compositions are mixtures of finely divided solder glass and an oxygen containing zinc material. The solder glasses are either lead-boron glasses or lead-zinc-boron glasses in which the zinc-lead mol ratio is below 1:2.