Abstract: A probe head for the testing of electronic devices is described having a contact probe having a body which extends between first and second ends adapted to contact respective contact pads, and a guide having a guide hole configured for housing at least a portion of the contact probe. The contact probe includes an elastically compliant intermediate section arranged between the first and second ends. The contact probe has a length of less than 2000 ?m, and the probe head includes a conductive portion formed on the guide which includes a group of guide holes and adapted to contact and short-circuit a corresponding group of contact probes that are housed in the group of holes and are intended to carry a given type of signal, thereby forming a given conductive domain, wherein a portion of the contact probe is in contact with the conductive portion.

Abstract: A probe head for the testing of electronic devices is disclosed having a contact probe that includes a body which extends between first and second ends adapted to contact respective contact pads, and a guide having a guide hole configured for housing at least a portion of the contact probe. The contact probe includes an intermediate section arranged between the first and second ends which is elastically compliant, wherein the elastically compliant intermediate section is structured as a plurality of elastic elements which follow one another in series so that the elastically compliant intermediate section is not rectilinear. At least one of the elastic elements is in contact with a wall of the guide hole.

Abstract: A probe head for the testing of electronic devices is herein disclosed having a contact probe with a body which extends along a longitudinal axis between a first and a second end which are adapted to contact respective contact pads. The body has a maximum thickness measured along a direction that is orthogonal to the longitudinal axis and a guide having at least one guide hole configured to house at least a portion of the contact probe. The contact probe includes an elastically compliant intermediate section arranged between the first and second ends. The elastically compliant intermediate section includes a reduced portion with a thickness less than the maximum thickness of the body of the contact probe.

Abstract: A probe head for testing electronic devices is disclosed having a contact probe with a body which extends between first and second ends which are adapted to contact respective contact pads and first and second guides having respective first and second guide holes. The contact probe includes an elastically compliant intermediate section arranged between the first and the second end. The elastically compliant intermediate section is arranged at at least one of the first and second guide holes. The contact probe also includes intermediate stop means arranged between the first and second guide and is configured to mechanically contact a portion of the first and/or second guide to hold the contact probe inside the probe head.

Abstract: It is herein described a probe head including at least one guide and a plurality of contact probes housed in a plurality of guide holes formed in the at least one guide, the plurality of contact probes being configured to abut onto a plurality of contact pads of a device under test, as well as at least one housing element configured to enclose the contact probes, further including a heat dispersion structure configured to collect and dissipate heat produced by the probe head and by the contact probes therein contained during test operations of the electronic device, the heat dispersion structure including at least one layer having thermal conductivity greater than 100 W/(m·K).

Abstract: A probe card configured to be mounted in a testing apparatus of electronic devices in contact with a test cell of the apparatus is described. The probe card includes at least one probe head that houses a plurality of contact probes and is arranged between a device under test and a space transformer, which is in turn in contact with a main board configured to be connected to the test cell and provided with a stiffener. Suitably, the probe card includes a heat dispersion device provided with at least one thermal pipe configured to thermally connect the probe card and the test cell and to realize a dispersion of a heat generated inside the probe card during the operation thereof.

Abstract: A probe head for testing devices under test integrated on a semiconductor wafer includes a plurality of contact probes having a body extending between first and second ends. The first end contacts contact pads of a device under test and the second end contacts contact Dads and a guide having guide holes housing a portion of the contact probes. The guide lies in a plane wherein the first and second ends of the contact probes are offset from each other and define a scrub direction of the first ends projecting from the guide holes which define abutting points against which corresponding inclined opposite walls of the contact probes abut. The inclined opposite walls deform the contact probes during contact with the device under test and control movement of the portion thereof within the guide holes, and the movement of the first end of the contact probes in the scrub direction.

Abstract: A probe card configured to be mounted in a testing apparatus of electronic devices includes at least one probe head that houses a plurality of contact probes, each contact probe having at least one first end portion configured to abut onto contact pads of a device under test, as well as a main board and an intermediate board connected to the main board , the intermediate board being adapted to perform a distance spatial transformation between contact pads formed on opposite faces thereof and acting as a space transformer. The space transformer comprises at least one core made of a material having a thermal conductivity greater than 100 W/(m·K) to collect and dissipate a heat produced by the probe card during testing operations of the electronic device.

Abstract: A probe head for testing a device under test integrated on a semiconductor wafer contains a plurality of contact probes having a body with first and second end portions adapted to contact respective pads, a guide with guide holes for housing the contact probes, and an air-conveying system to convey an air flow into the probe head to facilitate heat dissipation. The probe head further includes a conductive portion on the guide having a group of the guide holes which contacts and short circuits a corresponding group of contact probes in the group of holes and intended to carry a determined type of signal, defining a conductive domain on the guide. The heat dissipation conductive portion formed on the guide extends the conductive domain so that the air flow of the air-conveying system facilitates the dissipation of the heat exchanged by the heat dissipation conductive portion.

Abstract: A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.

Abstract: A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.

Abstract: A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.

Abstract: A probe card mounted in an of electronic device testing apparatus is described, having a probe head housing a plurality of contact probes, each having a first end portion which abuts onto contact pads of a device under test, a main board and a connected intermediate board which provides a distance spatial transformation between contact pads made on opposite faces thereof. The intermediate board is a space transformer which includes a plurality of modules that are plate-shaped and coplanar, and structurally and functionally independent from each other. Each module has a first face facing towards the probe head and a first plurality of contact pads whereonto respective second end portions of the contact probes abut and an opposite second face facing towards the main board. The second face has a second plurality of contact pads connected to the first plurality of contact pads.

Abstract: A contact element for a probe head for an electronic device test apparatus is disclosed, having a body extending along a longitudinal axis between a first and a second opposite contact end, each made of electrically conductive material. The body includes a first section which extends over a distance less than 1000 ?m along the longitudinal axis starting from the first contact end towards the second contact end, a second section which extends along the longitudinal axis starting from the second contact end towards the first contact end, and a third section, interposed between the first and second sections, made of an electrically insulating material. The sections follow each other along the longitudinal axis so that the first contact end is included only in the first section, the second contact end is included only in the second section, and the third section electrically insulates the first section from the second section.

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Abstract: A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 ?m and the second total thickness is greater than the first total thickness.

Abstract: A contact probe having a first end portion adapted to abut onto a contact pad of a device under test and a second end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body extended between the end portions along a longitudinal development direction is provided with an opening extending along the longitudinal development direction and defines at least one pair of arms in the probe body. Suitably, each arm of the at least one pair of arms has a not constant transversal section, which is perpendicular to the longitudinal development direction, having different areas in correspondence of different points along the probe body and ensures a distribution of the stress along the probe body during bending thereof during testing operation of the device under test performed by means of the contact probe.

Abstract: A contact probe is disclosed having a first end portion which ends with a contact tip configured to abut onto a contact pad of a device under test and a second end portion which ends with a contact head configured to abut onto a contact pad of a board of a testing apparatus, as well as a probe body extended between the first end portion and the second end portion along with a longitudinal development axis The first end portion includes a first support part, interposed between the probe body and the contact tip. Suitably, the first support part includes at least one contact pin and one probe length which extend parallel to each other along the longitudinal development axis and are separated by an air gap.

Abstract: A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.