Patents Assigned to Techonoplas, Inc.
  • Patent number: 4863651
    Abstract: A compression molding method includes detecting actual internal die pressure of molding material filled into a mold cavity, and regulating the compressive force exerted on the molding material in the mold cavity so as to conform the detected internal die pressure with a predetermined reference internal die pressure. The compressive force exerted on the molding material is controlled by a mold clamping mechanism or an extruder in accordance with the prescribed reference internal die pressure given in the form of a waveform, thereby to keep the actual internal die pressure of the molding material in the optimum condition. Consequently, molded products of high quality can be produced continuously.
    Type: Grant
    Filed: June 26, 1984
    Date of Patent: September 5, 1989
    Assignee: Techonoplas, Inc.
    Inventor: Shouichi Koten