Abstract: An electroplating chamber that allows substrates such as wafers to be effectively plated with the plating surface facing upwards. A method of reducing non-uniformity in the electroplating process is also disclosed. The chamber includes a bottom and a cover. The bottom contains a sidewall, an opening on top and securing means for securing substrates into the chamber during the plating process. At least one electrode retaining element is provided having at least one first electrode extending therefrom. The electrode retaining element is movable between an operating position and a release position. The cover contains a second electrode held above the substrate by an electrode holder.

Abstract: An apparatus for wet processing of substrates in a controlled environment. It is a single-substrate processing apparatus which is capable of carrying out etching, rinsing, and drying processes all in a single apparatus and in a controlled environment. A closed processing chamber is provided for processing a substrate in a closed environment. Processing liquids and gases are introduced into the chamber and the chamber is rotated with the substrate. Temperature inside the chamber is controlled by heating the gases. Humidity is controlled by varying the proportion of water vapor. The rotation of the chamber with the substrate creates a stable environment where processing parameters are more easily controlled.

Abstract: An apparatus for wet processing of substrates in a controlled environment. It is a single-substrate processing apparatus which is capable of carrying out etching, rinsing, and drying processes all in a single apparatus and in a controlled environment. A closed processing chamber is provided for processing a substrate in a closed environment. Processing liquids and gases are introduced into the chamber and the chamber is rotated with the substrate. Temperature inside the chamber is controlled by heating the gases. Humidity is controlled by varying the proportion of water vapor. The rotation of the chamber with the substrate creates a stable environment where processing parameters are more easily controlled.