Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Type:
Grant
Filed:
March 4, 2005
Date of Patent:
April 25, 2006
Assignees:
Recif, Societe Anonyme, Techsonic
Inventors:
Gil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Type:
Application
Filed:
March 4, 2005
Publication date:
July 7, 2005
Applicants:
Recif, Societe Anonyme, Techsonic
Inventors:
Gil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Type:
Grant
Filed:
November 18, 2002
Date of Patent:
April 19, 2005
Assignees:
Techsonic, Recif, Inc.
Inventors:
Gil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Type:
Application
Filed:
November 18, 2002
Publication date:
May 20, 2004
Applicants:
Recif, Societe Anonyme, Techsonic
Inventors:
Gil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
Abstract: A piezoelectric rotating motor includes a plurality of piezoelectric elements, a disk-shaped stator having a center portion in which the piezoelectric elements are accommodated, a circular friction zone which is formed on an outer peripheral portion of its one surface and a connecting portion which connects the center portion with the friction zone so as to form a lever transmitting and amplifying the axial strain of the piezoelectric elements to the portion of the friction zone located in the same angular sector as the piezoelectric elements and which has a cone shape at rear side of the friction zone so as to thin its thickness from the center portion to the outer peripheral portion and producing a progressive wave forming an elliptical vibration on the friction zone by the composition of its three dimensional strain due to the piezoelective effect of the piezoelectric elements and a rotor being contracted with the friction zone under pressure.
Type:
Grant
Filed:
February 1, 1995
Date of Patent:
September 10, 1996
Assignees:
IMRA Europe SA, Techsonic
Inventors:
Michel Gschwind, Tatsumi Mitsuta, Daniel Guyomar, Jean-Denis Sauzade, Thierry Mazoyer