Patents Assigned to Techwin Opto-Electronics Co., Ltd.
  • Patent number: 8721323
    Abstract: A lever-type mold ejection mechanism is arranged on a platen of a mold in the injection molding machine. The lever-type ejection mechanism includes a base body arranged on the platen; an actuating cylinder having a motion shaft; a link rod having a first end and a second end opposite to each other, wherein the first end is pivotally disposed on the base body through a first pivot axis, and the second end is pivotally disposed on an end of the motion shaft of the actuating cylinder through a second pivot axis, and the link rod has a movable ejector pin at its bottom surface adjacent to the first end; and a ejector rod resisting between the ejector pin and the mold. The actuating cylinder is operated to push the mold through the link rod in a lever manner so as to obtain enough pushing force.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 13, 2014
    Assignee: Techwin Opto-Electronics Co., Ltd.
    Inventor: Tsung-Huang Chen
  • Publication number: 20140030374
    Abstract: A lever-type mold ejection mechanism is arranged on a platen of a mold in the injection molding machine. The lever-type ejection mechanism includes a base body arranged on the platen; an actuating cylinder having a motion shaft; a link rod having a first end and a second end opposite to each other, wherein the first end is pivotally disposed on the base body through a first pivot axis, and the second end is pivotally disposed on an end of the motion shaft of the actuating cylinder through a second pivot axis, and the link rod has a movable ejector pin at its bottom surface adjacent to the first end; and a ejector rod resisting between the ejector pin and the mold. The actuating cylinder is operated to push the mold through the link rod in a lever manner so as to obtain enough pushing force.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 30, 2014
    Applicant: TECHWIN OPTO-ELECTRONICS CO., LTD.
    Inventor: Tsung-Huang CHEN
  • Publication number: 20140021592
    Abstract: A LED lead frame structure and a method of manufacturing LED lead frames are disclosed, in which the LED lead frame structure includes a metal base and insulating casings. The metal base has a plurality of lead areas, and two holes are formed on two opposing sides of each lead area. The insulating casings are formed on the lead areas respectively.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 23, 2014
    Applicant: TECHWIN OPTO-ELECTRONICS CO., LTD.
    Inventor: Chih-Lin CHI
  • Publication number: 20070196533
    Abstract: A mold for an LED lampshade comprising: an upper mold defined with a cavity in the bottom surface thereof; a lower mold defined with a slide recess corresponding to the cavity of the upper mold, a movable ejection block being received in the slide recess, the movable ejection block being movable back and forth along the slide recess, a cavity being defined in the top surface of the movable ejection block; and multiple ejection rods respectively disposed at the lower mold and at opposite sides of the movable ejection block and extending from the bottom of the lower mold to the top of the lower mold. When the mold of the present invention is used to injection mold, the LED lampshade is ejected by the movable ejection block in a manner of surface contact thereby preventing ejection marks on the surface of the LED lampshade.
    Type: Application
    Filed: April 20, 2006
    Publication date: August 23, 2007
    Applicant: TECHWIN OPTO-ELECTRONICS CO., LTD.
    Inventors: Y-Ju Chen, Jing-Wen Tzeng
  • Patent number: D530684
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: October 24, 2006
    Assignee: Techwin Opto-Electronics Co., Ltd.
    Inventor: Jing-Wen Tzeng
  • Patent number: D531141
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: October 31, 2006
    Assignee: Techwin Opto-Electronics Co., Ltd.
    Inventor: Jing-Wen Tzeng