Abstract: A handler for testing semiconductor device is disclosed. The handler for testing semiconductor device includes a socket plate having a test socket to be electrically connected to a tester, a device feeder configured to feed a semiconductor device to the test socket or recover the semiconductor device from the test socket, a camera obtaining an image of the test socket, a sensor sensing an exposing moment that at least one photographing area among photographing areas on the test socket is exposed to the camera, while the device feeder moves, and a controller configured to operate the camera to take a photograph at the exposing moment and to determine whether a semiconductor device remains in the test socket, using the image obtained by the camera.

Abstract: In accordance with an embodiment of the present invention, there is provided a circulation method of a test tray in a test handler, the method comprising: in case of a first mode of test of temperature condition, firstly circulating the test tray along a first circulation path; and in case of a second mode of test of temperature condition different from the first mode, secondly circulating the test tray along a second circulation path, wherein the first circulation path and the second circulation path are different from each other in the transfer direction of the test tray at least in some sections.

Abstract: A handler for testing a semiconductor device which is used when testing the fabricated semiconductor device. The handler for testing a semiconductor device includes a stacker to supply and accommodate a customer tray and a position selecting device to move the stacker and select a position of the stacker. By efficiently operating the stacker, the handler is able to continuously handle a large amount of semiconductor devices in a same testing process or continuously handle semiconductor devices in different lots, and equipment is prevented from becoming larger or having more complex designs so that required space, production costs and manpower are reduced and operating rates are improved.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A clamping apparatus for clamping a plurality of Hi-Fix boards arranged in a row, includes at least one rotational clamping unit installed to clamp facing end sides of the two or more Hi-Fix boards together, and a plurality of clamping units installed to clamp end sides of the Hi-Fix boards other than the facing sides thereof. The rotational clamping unit includes a clamper installed to rotate about a fixed rotation point to clamp or release the claming of the facing end sides of the two or more Hi-Fix boards, and a driving unit for providing a rotational force to the clamper.

Abstract: A handler for testing semiconductor device is disclosed. The handler for testing semiconductor device includes a socket plate having a test socket to be electrically connected to a tester, a device feeder configured to feed a semiconductor device to the test socket or recover the semiconductor device from the test socket, a camera obtaining an image of the test socket, a sensor sensing an exposing moment that at least one photographing area among photographing areas on the test socket is exposed to the camera, while the device feeder moves, and a controller configured to operate the camera to take a photograph at the exposing moment and to determine whether a semiconductor device remains in the test socket, using the image obtained by the camera.

Abstract: A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: An opener for a test handler is provided. Even when holding members of inserts of a carrier board are manipulated to release semiconductor devices that have been in a held state, a predetermined distance can remain between an upper surface of the opening plate and a lower surface of the insert, thus preventing the inserts from becoming defective.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: An opener and a buffer table for a test handler are disclosed. The opener includes an opening plate, a plurality of pin blocks forming pairs, and at least one or more interval retaining apparatus for retaining an interval between the pin blocks forming a pair. Each of the pin blocks is movably coupled to the opening plate, and includes opening pins for releasing a holding state of a holding apparatus that holds semiconductor devices in a carrier board. Although semiconductor devices to be tested are altered in size and a carrier board loading with the semiconductor devices is thus replaced, the opener does not need to be replaced, thereby reducing the replacement cost and the waste of resources.

Abstract: An insert for a carrier board of a test handler is disclosed. The insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch apparatus is installed to the insert pocket, so that the damaged latch apparatus can be easily replaced. The insert has a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes in the lower direction. Thus, the insert can load semiconductor devices regardless of the sizes of the semiconductor devices.

Abstract: An insert for a carrier board of a test handler is disclosed. In a first aspect, the latch block applying to the insert is detachably coupled to the insert body. The latch block can be reused, and thus this reduces wastage of resources and eliminates the insert replacement fee. In a second aspect, the insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch unit is installed to the insert pocket, so that the damaged latch unit can be easily replaced. The insert forms a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes downwardly. Thus, the insert can load semiconductor devices regardless of the dimensions of the semiconductor devices.

Abstract: A technology related to a pick-and-place apparatus for electronic device inspection equipment is provided. The pick-and-place apparatus includes the guiding unit that can interact with a loading element and can guide the picker to load the electronic devices at a correct position on the loading element. Therefore, the pick-and-place apparatus can allow the electronic devices, for example, semiconductor devices having a ball type of electrical contact lead (BGA, FBGA, etc.), to electrically contact the tester in a stable manner when the tester inspects the electronic devices.

Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Abstract: A system to support the testing of electronic devices and a temperature control unit for the system are disclosed. A temperature controlling method for a chamber of the system is also disclosed. Low or high temperature air is supplied to the inside of the chamber when the electronic devices are tested at low or high temperature. External air is supplied to the inside of the chamber when the electronic devices are tested at room temperature.

Abstract: A unit for opening an insert of a test tray which comprises an accommodating space for accommodating a semiconductor device and a support for supporting the semiconductor device accommodated in the accommodating space, the unit includes a body, a pair of opening devices provided in the body to open the insert, and a positioning guide unit protruding to be inserted into an accommodating space for a semiconductor device when opening the insert and supporting the semiconductor device that is transferred into the accommodating space to be spaced upward apart from a support provided in the accommodating space.

Abstract: A test tray for a test handler is disclosed that is loaded with semiconductor devices and then carries them along a predetermined circulation route. The test tray allows one fixing unit to fix a plurality of adjacent insert modules to the receiving spaces of the frame, thereby efficiently using the space of the frame and allowing a relatively large number of insert modules to be installed in the same area, in comparison to the conventional test tray.

Abstract: A test handler and method for operating a test handler for testing semiconductor devices are provided. The test handler includes a test tray located on one side of an opening apparatus in which a plurality of inserts are arrayed, wherein each insert comprises at least one semiconductor device loaded thereon, at least one opening unit for opening inserts at one part of the one side of the test tray, and a position changing apparatus comprises a motor including a driving pulley for moving at least one opening unit along a contact surface of the test tray such that the at least one opening unit changes positions on the test tray and is located at another part of the one side of the test tray in order to open inserts at the other part of the one side of the test tray.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.