Abstract: A handler for testing semiconductor device is disclosed. The handler for testing semiconductor device includes a socket plate having a test socket to be electrically connected to a tester, a device feeder configured to feed a semiconductor device to the test socket or recover the semiconductor device from the test socket, a camera obtaining an image of the test socket, a sensor sensing an exposing moment that at least one photographing area among photographing areas on the test socket is exposed to the camera, while the device feeder moves, and a controller configured to operate the camera to take a photograph at the exposing moment and to determine whether a semiconductor device remains in the test socket, using the image obtained by the camera.

Abstract: In accordance with an embodiment of the present invention, there is provided a circulation method of a test tray in a test handler, the method comprising: in case of a first mode of test of temperature condition, firstly circulating the test tray along a first circulation path; and in case of a second mode of test of temperature condition different from the first mode, secondly circulating the test tray along a second circulation path, wherein the first circulation path and the second circulation path are different from each other in the transfer direction of the test tray at least in some sections.

Abstract: A handler for testing a semiconductor device which is used when testing the fabricated semiconductor device. The handler for testing a semiconductor device includes a stacker to supply and accommodate a customer tray and a position selecting device to move the stacker and select a position of the stacker. By efficiently operating the stacker, the handler is able to continuously handle a large amount of semiconductor devices in a same testing process or continuously handle semiconductor devices in different lots, and equipment is prevented from becoming larger or having more complex designs so that required space, production costs and manpower are reduced and operating rates are improved.

Abstract: A handler for testing semiconductor device is disclosed. The handler for testing semiconductor device includes a socket plate having a test socket to be electrically connected to a tester, a device feeder configured to feed a semiconductor device to the test socket or recover the semiconductor device from the test socket, a camera obtaining an image of the test socket, a sensor sensing an exposing moment that at least one photographing area among photographing areas on the test socket is exposed to the camera, while the device feeder moves, and a controller configured to operate the camera to take a photograph at the exposing moment and to determine whether a semiconductor device remains in the test socket, using the image obtained by the camera.

Abstract: A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time.

Abstract: A system and method is disclosed that transfers carrier boards in a handler that supports the testing of electronic devices. A carrier board can be transferred from the transfer start position to one of the mid transfer positions and the transfer final position. Carrier boards, which are spaced apart from each other in a chamber, can be gathered adjacent to each other in the circulation direction of carrier board. The transfer speed and the total circulation speed of the carrier boards can be enhanced. The transfer speed of carrier board can be easily controlled according to the test conditions.

Abstract: An opener for a test handler is provided. Even when holding members of inserts of a carrier board are manipulated to release semiconductor devices that have been in a held state, a predetermined distance can remain between an upper surface of the opening plate and a lower surface of the insert, thus preventing the inserts from becoming defective.

Abstract: An insert for a carrier board of a test handler is disclosed. In a first aspect, the latch block applying to the insert is detachably coupled to the insert body. The latch block can be reused, and thus this reduces wastage of resources and eliminates the insert replacement fee. In a second aspect, the insert pocket having hooks is detachably coupled to the insert body. The insert body can be reused. The latch unit is installed to the insert pocket, so that the damaged latch unit can be easily replaced. The insert forms a plurality of holes in the bottom of the loading part thereof, to expose the leads of the semiconductor devices through the holes downwardly. Thus, the insert can load semiconductor devices regardless of the dimensions of the semiconductor devices.

Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.

Abstract: A system to support the testing of electronic devices and a temperature control unit for the system are disclosed. A temperature controlling method for a chamber of the system is also disclosed. Low or high temperature air is supplied to the inside of the chamber when the electronic devices are tested at low or high temperature. External air is supplied to the inside of the chamber when the electronic devices are tested at room temperature.

Abstract: A unit for opening an insert of a test tray which comprises an accommodating space for accommodating a semiconductor device and a support for supporting the semiconductor device accommodated in the accommodating space, the unit includes a body, a pair of opening devices provided in the body to open the insert, and a positioning guide unit protruding to be inserted into an accommodating space for a semiconductor device when opening the insert and supporting the semiconductor device that is transferred into the accommodating space to be spaced upward apart from a support provided in the accommodating space.

Abstract: A test handler and method for operating a test handler for testing semiconductor devices are provided. The test handler includes a test tray located on one side of an opening apparatus in which a plurality of inserts are arrayed, wherein each insert comprises at least one semiconductor device loaded thereon, at least one opening unit for opening inserts at one part of the one side of the test tray, and a position changing apparatus comprises a motor including a driving pulley for moving at least one opening unit along a contact surface of the test tray such that the at least one opening unit changes positions on the test tray and is located at another part of the one side of the test tray in order to open inserts at the other part of the one side of the test tray.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Abstract: A pick-and-place module for test handlers includes a main body, and a kit. The main body has N-th vacuum paths (where N is plural). The kit has M-th pickers. The M-th pickers are provided so as respectively correspond to M-th vacuum passages (where 1?M?N), which are formed to respectively correspond to all or some of the N-th vacuum paths formed in the main body, and holds semiconductor devices or releasing the held semiconductor devices using vacuum pressures. The kit is detachably mounted to the main body.

Abstract: A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time.

Abstract: An opener for a test handler is provided. Even when holding members of inserts of a carrier board are manipulated to release semiconductor devices that have been in a held state, a predetermined distance can remain between an upper surface of the opening plate and a lower surface of the insert, thus preventing the inserts from becoming defective.

Abstract: A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.

Abstract: A test handler is disclosed. The test handler includes first to third transfers for transferring a user tray, and first to third horizontal movement units suitable for respectively moving the first to third transfers in a horizontal direction. The first to third horizontal movement units are independently operated such that each of the first to third transfers can perform independently horizontal movements. Each of the first to third transfers performs based on its previously allocated function, thereby enhancing test process speed for devices.

Abstract: A pick and place apparatus includes a 1st to an nth device holding element arranged in a lengthwise direction, every one of the 1st to the nth device holding element being connected to its neighboring one(s) of the 1st to the nth device holding element by means of at least one pitch setting ring; a belt having a first coupling part at an upper part thereof for being coupled to the 1st device holding element and a second coupling part at a lower part thereof for being coupled to the nth device holding element; and a driven pulley and a differential pulley. The driven and the differential pulley are rotated by being engaged with the belt to move the 1st and the nth device holding element such that the 1st device holding element moves in a direction opposite to the nth device holding element.

Abstract: A test handler includes a loading unit for loading semiconductor devices from customer trays onto a test tray; a test chamber for performing a test for the semiconductor devices loaded on the test tray; a pushing unit having at least one pushing member for pushing the test tray located in the test chamber to be tested, and a press unit for operating the pushing member; a position control unit for adjusting a position of the pushing member to compensate a deviation between the pushing member and the test tray due to a thermal expansion or contraction of any one of the pushing member and the test tray; and an unloading unit for unloading the semiconductor devices loaded on the test tray onto the customer trays after a test for the semiconductor devices is completed.