Abstract: A glass shaping method capable of grinding and/or polishing a fine brittle material more stably than conventional methods is provided. The glass shaping method of the present invention comprises: a mold forming step of shaping a surface of a base material having a higher melting temperature than a glass softening point to form a mold 10; a glass molding step of sealing softened glass into a groove 15 formed in a surface of the mold 10 by the forming step to mold a glass substrate 17; a glass processing step of cutting, grinding and/or polishing the glass substrate 17, with the mold 10 being fixed, to form a glass shaped article 1; and a step of eliminating only the base material 16 of the mold 10 after the glass processing step to remove the glass shaped article 1 from the mold.

Abstract: A method of producing display panels of collectively producing a plurality of display panels each including a contour line of an outer shape, at least a section of which is curved includes a bonding process of forming a bonded substrate by bonding a pair of substrates including a plurality of thin film patterns formed on at least one substrate, a stacking process of stacking a plurality of bonded substrates and pinching and holding the plurality of stacked bonded substrates in a stacking direction using a jig, and a grinding process of collectively forming end surfaces of the plurality of display panels forming the curved contour line by collectively grinding the pair of substrates located outside the thin film pattern among stacked bonded substrates along the outer shape in a state in which the plurality of stacked bonded substrate are pinched by the jig.

Abstract: The present invention provides a water-cooled heat sink having an integrated structure, and having inside a precise, freely formed flow path, the water-cooled heat sink being produced without using a technique for pasting a plurality of metal sheets. In a water-cooled heat sink 1, a formed body 2 is provided outwardly, a flow path 3 for passage of a liquid is formed inwardly of the formed body 2, and an inlet 5 and an outlet 4 for the liquid, which communicate with the flow path 3, are formed in the main body of the heat sink 1. The entire formed body 2 of the heat sink 1 is integrally formed by thick coating layers applied by electroplating, and has no joints.

Abstract: The present invention provides a water-cooled heat sink having an integrated structure, and having inside a precise, freely formed flow path, the water-cooled heat sink being produced without using a technique for pasting a plurality of metal sheets. In a water-cooled heat sink 1, a formed body 2 is provided outwardly, a flow path 3 for passage of a liquid is formed inwardly of the formed body 2, and an inlet 5 and an outlet 4 for the liquid, which communicate with the flow path 3, are formed in the main body of the heat sink 1. The entire formed body 2 of the heat sink 1 is integrally formed by thick coating layers applied by electroplating, and has no joints.

Abstract: A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regi

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Abstract: A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regi

Abstract: The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members.

Abstract: The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base members 21, 31 and 41, the base member being each in plate or block-shape, the base member each having paths 60 shaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow path 60a including path 60, through holes 61, 62, and 63, is formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layer 54 made of Au—Sn alloy or Sn, while a coating layer of Au 53 is formed on each of the inner surfaces of the bonded base members.