Patents Assigned to Tecstar Power System, Inc.
  • Patent number: 6407327
    Abstract: A radiation tolerant solar cell array module which can be efficiently assembled into a larger solar panel to generate power for a spacecraft the module includes at least first and second single-crystal solar cells. The first and second solar cells have front sides and back sides. At least one of the solar cells has a shallow junction N on P structure. A first contact is formed on at least the back side of the first solar cell. A second contact formed on at least the back side of the second solar cell. A conductor is in electrical communication with the first contact and the second contact. A substantially transparent ceria-doped cover overlays at least a portion of each of the solar cells. The cover remains substantially transparent when exposed to an AM0 space radiation environment. A substantially transparent adhesive is situated between the cover and the solar cell portions. The adhesive remains substantially transparent when exposed to a space radiation environment.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: June 18, 2002
    Assignee: Tecstar Power Systems, Inc.
    Inventors: Eugene Ralph, Ellen B. Linder, James P. Hanley, Mark DeWitt, James R. Walle, Norman L. Beze
  • Patent number: 6359210
    Abstract: The present invention is directed to systems and methods for protecting a solar cell. The solar cell includes first solar cell portion. The first solar cell portion includes at least one junction and at least one solar cell contact on a backside of the first solar cell portion. At least one bypass diode portion is epitaxially grown on the first solar cell portion. The bypass diode has at least one contact. An interconnect couples the solar cell contact to the diode contact.
    Type: Grant
    Filed: January 2, 2001
    Date of Patent: March 19, 2002
    Assignee: Tecstar Power System, Inc.
    Inventors: Frank Ho, Milton Y. Yeh, Chaw-Long Chu, Peter A. Iles
  • Patent number: 6326540
    Abstract: An efficient method of interconnecting a solar cell having at least two front surface contacts with a diode mounted on a front surface of the solar cell includes the act of forming at least a first recess on a front surface of the solar cell. A first solar cell contact is formed on the front surface in the first recess. A second solar cell contact is formed on the front surface. At least a first bypass diode is positioned at least partly within the recess. The bypass diode has a first diode contact and a second diode contact. The first solar cell contact is interconnected with the first diode contact. The second solar cell contact is interconnected with the second diode contact.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: December 4, 2001
    Assignee: Tecstar Power Systems, Inc.
    Inventors: Louis C. Kilmer, Mark DeWitt, James Patrick Hanley, Peng-Kuen Chiang
  • Patent number: 6278054
    Abstract: The present invention is directed to systems and methods for protecting a solar cell. The solar cell includes first solar cell portion. The first solar cell portion includes at least one junction and at least one solar cell contact on a backside of the first solar cell portion. At least one bypass diode portion is epitaxially grown on the first solar cell portion. The bypass diode has at least one contact. An interconnect couples the solar cell contact to the diode contact.
    Type: Grant
    Filed: May 19, 1999
    Date of Patent: August 21, 2001
    Assignee: Tecstar Power Systems, Inc.
    Inventors: Frank Ho, Milton Y. Yeh, Chaw-Long Chu, Peter A. Iles
  • Patent number: 6156967
    Abstract: A radiation tolerant solar cell array module which can be efficiently assembled into a larger solar panel to generate power for a spacecraft the module includes at least first and second single-crystal solar cells. The first and second solar cells have front sides and back sides. At least one of the solar cells has a shallow junction N on P structure. A first contact is formed on at least the back side of the first solar cell. A second contact formed on at least the back side of the second solar cell. A conductor is in electrical communication with the first contact and the second contact. A substantially transparent ceria-doped cover overlays at least a portion of each of the solar cells. The cover remains substantially transparent when exposed to an AM0 space radiation environment. A substantially transparent adhesive is situated between the cover and the solar cell portions. The adhesive remains substantially transparent when exposed to a space radiation environment.
    Type: Grant
    Filed: June 4, 1998
    Date of Patent: December 5, 2000
    Assignee: Tecstar Power Systems, Inc.
    Inventors: Eugene Ralph, Ellen B. Linder, James P. Hanley, Mark DeWitt, James R. Walle, Norman L. Beze
  • Patent number: 6103970
    Abstract: An efficient method of interconnecting a solar cell having at least two front surface contacts with a diode mounted on a front surface of the solar cell includes the act of forming at least a first recess on a front surface of the solar cell. A first solar cell contact is formed on the front surface in the first recess. A second solar cell contact is formed on the front surface. At least a first bypass diode is positioned at least partly within the recess. The bypass diode has a first diode contact and a second diode contact. The first solar cell contact is interconnected with the first diode contact. The second solar cell contact is interconnected with the second diode contact.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: August 15, 2000
    Assignee: Tecstar Power Systems, Inc.
    Inventors: Louis C. Kilmer, Mark DeWitt, James Patrick Hanley, Peng-Kuen Chiang