Patents Assigned to Tefco International Co., Ltd.
  • Patent number: 5891285
    Abstract: A process for manufacturing electroformed patterns includes the following steps: forming electroformed closed line graphic patterns and an electroformed line surrounding said patterns (optionally together with an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (optionally together with the electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; injecting or printing a coating material inside the closed line graphic electroformed patterns and converting the coating material to coating films; forming a firmly bonding adhesive layer on a whole surface of the support on its side where the electroformed patterns, the coating films and the electroformed line (optionally together with the electroformed island) are retained; removing the electroformed line (optionally together with the electroformed island); separating the electroformed patterns and the coating films
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: April 6, 1999
    Assignee: Tefco International Co., Ltd.
    Inventor: Hajime Nakayama
  • Patent number: 5501785
    Abstract: The process for manufacturing electroformed patterns according to the present invention comprises: forming electroformed patterns and an electroformed line surrounding said patterns (and optionally an electroformed island) on a surface of a conductive substrate; peeling the electroformed patterns and the electroformed line (and optionally an electroformed island) from the conductive substrate to transfer them onto a pressure-sensitive adhesive layer provided on a support; forming a firmly bonding adhesive layer on the whole surface of the side where the electroformed patterns and the electroformed line (and optionally an electroformed island) are retained; removing the electroformed line (and optionally an electroformed island); and adhering the electroformed patterns to a surface of an adherend through the firmly bonding adhesive layer, simultaneously with separating the electroformed patterns from the support. According to this invention, the electroformed patterns can be manufactured at a low cost.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: March 26, 1996
    Assignee: Tefco International Co., Ltd.
    Inventor: Hiroo Nakayama