Abstract: A probe for use with a measuring instrument. The probe is a wired probe assembly comprising a housing with an integrated user interface. The wired probe assembly further comprises a measuring component for contacting a device to be measured and a cord component connecting the measuring component to the measuring instrument. The user interface can indicate a status of an electrical parameter and allow an operator to provide inputs remotely to the measuring device.

Abstract: An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.

Abstract: A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

Abstract: An in-line suspended power sensor coupling configuration situated within a high frequency transmission line housing that allows forward, reverse, and sampling voltage elements to all be produced simultaneously on one double sided printed circuit board (PCB). The power sensor coupling allows for calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.

Abstract: A power sensor system, assembly and method for use as a power sensor standard in the 50 to 75 GHz frequency range. The power sensing system comprises a housing comprising a dual ridged waveguide impedance transformer, and a resistive component attachable to a back side of the housing. The resistive component comprises a terminating element electrically, but not thermally isolated from a sensing element. The sensing element operates at a constant resistance and is perpendicularly oriented to the terminating element.

Abstract: A dual-coplanar sensor architecture is constructed by launching from coaxial airline to a unique arrangement of coplanar waveguides, arranged symmetrically on both sides of a thin dielectric substrate. The center conductor of the coaxial airline makes electrical contact with the middle conductor of both the top and bottom coplanar waveguides. The characteristic impedance of the top and bottom coplanar waveguides is designed to be approximately twice the characteristic impedance of the coaxial airline, such that the parallel combination of the two coplanar waveguides is the characteristic impedance of the coaxial airline. Further, steps in both the ground planes and center conductor at the point of transition from coaxial to coplanar are used to tune the launch and minimize reflection at the launch.

Abstract: A co-axial microwave bolometer architecture is disclosed that uses thick-film processes to construct very small thermistors on a substrate that is selected for low heat transfer. Thermal isolation is further enhanced by making the planar electrodes from a metal with lower heat transfer than typical electrical metals. Furthermore, a resistor with very strong temperature coefficient (thermistor), is arranged such that connecting metal paths are arranged axially, and as generally flat, thin, planar conductors. Additionally, the substrate of the thermistor is selected to have very low conductivity of heat, so the thermistor element itself is well isolated thermally from its surroundings.

Abstract: A dual-coplanar sensor architecture is constructed by launching from coaxial airline to a unique arrangement of coplanar waveguides, arranged symmetrically on both sides of a thin dielectric substrate. The center conductor of the coaxial airline makes electrical contact with the middle conductor of both the top and bottom coplanar waveguides. The characteristic impedance of the top and bottom coplanar waveguides is designed to be approximately twice the characteristic impedance of the coaxial airline, such that the parallel combination of the two coplanar waveguides is the characteristic impedance of the coaxial airline. Further, steps in both the ground planes and center conductor at the point of transition from coaxial to coplanar are used to tune the launch and minimize reflection at the launch.

Abstract: A co-axial microwave bolometer architecture is disclosed that uses thick-film processes to construct very small thermistors on a substrate that is selected for low heat transfer. Thermal isolation is further enhanced by making the planar electrodes from a metal with lower heat transfer than typical electrical metals. Furthermore, a resistor with very strong temperature coefficient (thermistor), is arranged such that connecting metal paths are arranged axially, and as generally flat, thin, planar conductors. Additionally, the substrate of the thermistor is selected to have very low conductivity of heat, so the thermistor element itself is well isolated thermally from its surroundings.

Abstract: A voltage measuring instrument which generally includes signal conditioning circuitry coupled to input probes for protection against overvoltages and processing of input voltage signals. A VAC/VDC control circuit will determine whether AC or DC voltages are present, and will positively indicate when no voltage is present in a test circuit. The metering circuit of the invention will thereby automatically determine the proper mode of operation for the type of voltage present in a test circuit so as to eliminate user selection of operating parameters and possible errors. Further, the metering circuit is adapted to generate a proper reference voltage for the measured voltage automatically, to again eliminate selection of a voltage range by the user. A power supervision circuit is adapted to automatically shut off the measuring instrument after a predetermined amount of time has elapsed, and will automatically shut off power in the event that available battery power drops below a given level.

Abstract: A method and apparatus for testing handheld soldering irons having a three wire soldering tip by touching the soldering iron tip to a single point sensor to measure tip temperature, tip voltage to ground the tip resistance to ground. A thermocouple sensor for use with a soldering iron testing apparatus is described.