Abstract: The present invention relates to a method for manufacturing a thermoelectric half-cell which utilises the metallization for obtaining both the electric and thermal contact required to form a functional thermoelectric cell.

Abstract: Electric energy generating device (1) for installation to an exhaust conduit (2) in which an exhaust gas (9) is flowing, comprising: —a thermoelectric generator (3) comprising a hot side (4) and a cold side (5), —at least one hot side heat transfer loop (6) comprising a fluid conduit circuit having a thermal fluid circulating therein, and where the fluid conduit circuit comprises: —a first in section (7) n thermal contact with the hot side (4), —a second section (8) adapted to be in thermal contact with the exhaust gas (9), —a third section (10) and a fourth section (11), wherein the third section (10) and the fourth section (11) each comprises at least one vibrational damping part (12), wherein each of the at least one vibrational damping part (12) comprises a heat resistant and flexible tube integrated into the third section (10) and the fourth section (11) of the fluid conduit circuit.

Abstract: A method for manufacturing a thermoelectric module utilizes solid-liquid interdiffusion bonding for both forming metallization, interconnection and bonding between thermoelectric elements and electric contacts and forming of a hermetic sealing of the thermoelectric module.

Abstract: The present invention relates to a method for manufacturing a thermoelectric half-cell which utilises the metallization for obtaining both the electric and thermal contact required to form a functional thermoelectric cell.

Abstract: The present invention relates to a method for pre-processing semiconducting thermoelectric materials for metallization, interconnection and bonding to form a thermoelectric device, and thermoelectric devices utilising the pre-processed processing semiconducting thermoelectric materials made by the method, where a cost-effective, simple and resilient interconnection and bonding of semiconducting thermoelectric materials to the electrodes of thermoelectric devices is obtained by employing the solid-liquid interdiffusion bonding concept in combination with use of an adhesion layer/diffusion barrier layer/adhesion layer structure (interchangeably also termed as; the ADA-structure) in-between the solid-liquid interdiffusion bonding layers and the semiconducting thermoelectric material.