Patents Assigned to Teijin Seikei Co., Ltd.
  • Patent number: 6200732
    Abstract: There is provided a photocurable resin composition comprising (A) an urethane acrylate having three or four acrylate groups in the molecule, (B) a radical polymerizable compound different from the above urethane acrylate; and (C) a photopolymerization initiator, the weight ratio of the urethane acrylate (A) to the radical polymerizable compound (B) being 80:20 to 10:90; and a production process thereof. The said photocurable resin composition can provide moldings and stereolithographed objects having excellent dimensional accuracy with a small volume shrinkage factor at the time of photo-curing and excellent heat resistance with a high thermal deformation temperature as well as excellent transparency and mechanical properties such as tensile strength.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: March 13, 2001
    Assignee: Teijin Seikei Co., Ltd.
    Inventors: Yorikazu Tamura, Tsuneo Hagiwara