Abstract: A modular tray system for holding component carriers includes a rectangular frame having retaining elements in the form of slots or pegs along opposite sides. Rails or partitions are arranged in parallel and selectively spaced apart along the opposite sides, and spaced apart along the opposite sides, and spanning between the opposite sides. Component carriers such as strips of thermoformed component-holding carrier tape are supported on the spaced apart rails. The modules can be stacked to allow for the holding of component carriers having relatively deep component-holding pockets.

Abstract: A carrier tape formed with a plurality of product receiving pockets molded therein. Pocket detail is formed by moving a male mold element and the carrier tape relatively toward one another thereby causing a respective region of the tape to conform to the shape of the mold element. Fluid pressure can be used to drive the carrier tape further into conformity with the shape of the respective mold element. A vacuum channel can be provided in the mold element to reduce the pressure on the side of the tape adjacent to the mold thereby increasing the pressure differential across the tape. Both multi-station linear and rotary molds carrying male molding surfaces can be used to increase throughput. Product positioning surfaces, formed on the male mold elements can be imparted to the interior of the formed pockets along with light diffusing patterns to provide improved performance by scanning or optical monitoring systems.