Abstract: A coating comprising elemental silicon is electrodeposited on a substrate from an aqueous medium. The plating bath is a solution of what is described as one or more metal hydrides. The metal hydrides of the present invention are provided by combining stoichiometric amounts of metal, alkaline metal hydroxide and water in a preselected proportion by mole percent. The particular proportion is a function of the particular metal. A hydride concentrate is provided which is used in aqueous solution to provide a plating bath.
Abstract: A coating comprising elemental silicon is electrodeposited on a substrate from an aqueous medium. The plating bath is a solution of what is described as one or more metal hydrides. The metal hydrides of the present invention are provided by combining stoichiometric amounts of metal, alkaline metal hydroxide and water in a preselected proportion by mole percent. The particular proportion is a function of the particular metal. A hydride concentrate is provided which is used in aqueous solution to provide a plating bath.