Abstract: A heat process device according to the present invention includes a film-like heating body serving as a heat source for a heat transfer plate on which an object to be processed is mounted and heated. Therefore, the heat process device can be excellent in controlling the heating temperature. It can also apply a uniform heat process to the object. Further, it can be made small in size and easy to operate.

Abstract: Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

Abstract: Disclosed is a coating apparatus, comprising a gas exhaust rate controller disposed within an exhaust pipe connected to a cup which houses a substance to be treated, and a branch pipe connected to the exhaust pipe. The flow speed of the fluid within the branch pipe is measured, and the driving of the exhaust rate controller is controlled based on the measured value of the flow speed in accordance with the state of treatment of the object to be treated.

Abstract: A resist process apparatus of the invention serves to load/unload a semiconductor wafer in/from the respective process mechanisms. The apparatus includes a wafer holding member for holding a semiconductor wafer, and X, Y, Z and .theta. driving mechanisms for conveying the wafer holding member to a resist coating mechanism and the like. The wafer holding member includes a support frame which is larger than diameter of a semiconductor wafer, and a plurality of support members, arranged on the support frame, for supporting the semiconductor wafer in partial contact with the peripheral portion of the semiconductor wafer. Since the contact area between the support members and a semiconductor wafer is small, changes in temperature of the semiconductor, when it is held, are small.

Abstract: In a method of measuring the flow rate of an exhaust gas, an external atmosphere is caused to flow into a pipe which branches off from the main pipe to open at the other end onto the external atmosphere. The flow rate of the atmosphere in the branched-pipe is measured, and the flow rate of the exhaust gas in the main pipe corresponding to the measured value is determined based on a calibration curve.

Abstract: A processing liquid supply unit comprises a storage tank for storing a processing liquid, a sensor for sensing the amount of processing liquid stored in the storage tank, a refilling mechanism for automatically refilling the processing liquid into the storage tank when the sensor senses that the amount of processing liquid in the storage tank drops below the specified value and a processing liquid delivery mechanism for delivering the processing liquid from the storage tank to an object being processed.

Abstract: Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

Abstract: An apparatus is disclosed which forms a photo-resist film on a substrate surface and/or develops it.

Abstract: In an exposure method of the present invention, exposure light is radiated onto a peripheral portion of a substrate to be processed while the substrate is rotated, and the rotational speed of the substrate is selectively decreased when a specific peripheral portion reaches an exposure area, thereby performing predetermined exposure of the substrate. An exposure apparatus of the present invention includes a mounting table on which the substrate is mounted, a rotating mechanism for rotating the mounting table at a predetermined rotational speed, a light radiating element arranged to oppose a mounting surface of the mounting table, light amount control means for controlling the amount of light radiated from the light radiating element onto the substrate, and rotational speed control means for controlling the rotational speed of the mounting table in accordance with the radiation amount of light from the light radiating element.

Abstract: A coating device includes a ring-shaped outer circumferential groove formed along and adjacent to the outer circumferential rim of a cup means and communicated with a processing vessel, and a processing liquid supply source connected to the outer circumferential groove through nozzles. A partition wall is erected, as an inner wall of the cup means, inside the outer circumferential groove with the nozzles and a groove interposed between them. The supply of the processing liquid can be thus made stable and processing failure because of air bubbles mixed in the liquid and irregular coating of the liquid on substrates can be prevented.