Abstract: A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.

Abstract: A substrate chuck includes a frame forming a support adapted to support an adhering surface thereon, and a Bernoulli chuck surface coupled to the frame and adapted to support the substrate. The Bernoulli chuck surface is axially moveable relative to the support between first and second positions. In the first position, the substrate is coupled to the adhering surface, and the substrate is separated from the adhering surface with movement of the Bernoulli chuck from the first position to the second position, without contact between the substrate and the Bernoulli chuck surface.

Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.

Abstract: Techniques disclosed herein a method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a substrate. Techniques include creating a separation or smoothing layer between a nucleation layer process and a metallization or gapfill process. The addition of such a separation layer avoids dissolving a seed layer and gapfill complications from remnant organic material. Techniques include adding a conformal copper smoothing layer step after applying a direct on-barrier nucleation layer. The smoothing layer adds a sufficient thickness so that the gapfill chemistry does not erode the nucleation layer. The smoothing layer can also provide a high-purity copper film that will not detrimentally interact with the TSV gapfill chemistry. This smoothing layer can also provide a surface with consistent roughness to allow uniform adhesion of the organic additives in the TSV gapfill chemistry to create a filling profile that is void-free.

Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.

Abstract: A method and apparatus for wetting the surface of a workpiece is disclosed. The apparatus includes a chamber with a vacuum port and a fluid port and a workpiece holder including a body, a ring, and a port. The body includes a surface and defines a cavity extending from the surface. The ring is adapted to retain the workpiece on the surface of body over the cavity. The ring forms a fluid seal relative to the workpiece and to the workpiece holder. The port is defined in the body and in communication with the cavity. The port affects pressure in the cavity to minimize a pressure differential between the front and back surfaces of the workpiece. The fluid port is in communication with the chamber. The fluid port delivers a fluid (e.g., a substantially degassed fluid) to wet the front surface of the workpiece during operation of the chamber at a reduced pressure relative to atmosphere.

Abstract: A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.

Abstract: A substrate edge bevel etch module for etching a material from a peripheral edge of a substrate with an etchant is described. The substrate edge bevel etch module includes a rotatable substrate holder having a support for a substrate, and a surface tension etch applicator comprising a wetted etching surface opposing a substrate surface proximate an edge of the substrate when the surface tension etch applicator is located proximate to the edge of the substrate. The surface tension etch applicator further includes an etchant dispensing portion, proximate the wetted etching surface, which dispenses an etchant in a region between the wetted etching surface and the substrate surface and wet at least a portion of the wetted etching surface and the substrate surface. A spacing between the wetted etching surface and the substrate surface is selected to retain the etchant using surface tension forces and form a meniscus there between.

Abstract: A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.

Abstract: A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.