Abstract: A semiconductor imager device is arranged for receiving a series of charge packets. It comprises a charge-to-voltage conversion circuit for receiving the charge packets on a reception capacitance and has an interconnected arrangement of a floating diffusion, a first reset gate, a reset drain and a source follower for readout. In particular, the device has a series arrangement of at least the first reset gate as a proximate reset gate and furthermore a distal reset gate, wherein in a high-gain configuration the proximate reset gate is cyclically controlled and the distal reset gate is continuously on, thus limiting the reception capacitance to a relatively low value. Alternatively, in a low-gain configuration the proximate reset gate is continuously on, thus extending the capacitance to a relatively high value and the distal reset gate replaces the proximate reset gate as being cyclically controlled for conversion of the series of charge packets.

Abstract: A device and method for continuous vertical clocking a charge-coupled device image sensor operating in a time delay and integration and binning mode of operation is disclosed. The method includes providing a charge-coupled device image sensor with a continuous charge transfer signal to a vertical charge-coupled device register for shifting charge continuously to more closely approximate the speed of movement of the target object of capture by the image sensor in order to eliminate artifacts in the TDI imaging direction. The control module of the CCD image sensor provides the continuous charge transfer signal to the vertical charge-coupled device register.

Abstract: A plural line CMOS sensor array device is provided with sensor cells arranged in a matrix of coordinate-wise rows and columns. Each cell comprises a photosensitive area, an output node, and a transfer gate for selectively interconnecting the photosensitive area and the output node. Along at least a first coordinate direction adjacent cells are functionally configured as mutually mirror-symmetric structures in that their proximate output nodes are facing each other and are arranged for separately feeding a respective output channel. Preferably, also in a second coordinate direction adjacent cells are functionally configured as mutually mirror-symmetric structures in that their proximate output nodes are facing each other and all such facing output nodes are separately feeding a respective column-directed output channel.

Abstract: A method of sealing a package includes plating a perimeter of a hole formed in a package and attaching a solder film to the plated perimeter, the solder film covering the hole. The method further includes assembling a device in the package and sealing the package to define an interior and an outside, the device being contained within the interior. Next, the method includes heating the assembled package in a vacuum oven to a predetermined temperature where the solder film bonds to the plated perimeter, evacuating the vacuum oven to form a vacuum until the solder film fractures as a gas contained in the interior escapes to the outside, and further heating the assembled package in the vacuum oven after the gas in the interior escapes to the outside and until the solder film re-melts and seals over the hole.

Abstract: A method of using a line-scan sensor device to scan an image includes determining and removing. The device includes sensor cells arranged in a matrix of rows and columns. The determining includes determining when a pixel signal value from a pixel in a first row and in a column deviates from a pixel signal value from a pixel in a second row and in said column. The removing includes removing the pixel signal value of the pixel in the first row and in said column when the pixel signal value from the pixel in the first row and in said column deviates from the pixel signal value from the pixel in the second row and in said column. The pixel in the first row and in said column images a portion of the image and the pixel in the second row and in said column images the same portion of the image.

Abstract: An assembly includes a first packaged device that contains a first image sensor having first fiducial marks thereon. On a portion of the first packaged device at a predetermined location relative to the first fiducial marks is adhesive, and a first connection body is fixed within the adhesive and registered at the predetermined location relative to the first fiducial marks. The first connection body is mated into the first counter hole formed in a plate at a predetermined location.