Patents Assigned to Teledyne Dalsa Semiconductor Inc.
  • Patent number: 8975193
    Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: March 10, 2015
    Assignee: Teledyne DALSA Semiconductor, Inc.
    Inventors: Robert Johnstone, Stephane Martel
  • Publication number: 20130034467
    Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Applicant: TELEDYNE DALSA SEMICONDUCTOR, INC.
    Inventors: Robert Johnstone, Stephane Martel
  • Publication number: 20130032210
    Abstract: An integrated microfluidic device has at least at least one active element controlled by pneumatic signals, and at least one electrostatic actuator integrated in the device for generating the pneumatic signals within the device from an external supply of pressure or vacuum. In one embodiment the pressure supply may be generated internally on chip using an integrated pump.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Applicant: TELEDYNE DALSA SEMICONDUCTOR, INC.
    Inventors: Robert Johnstone, Stephane Martel
  • Publication number: 20130032235
    Abstract: An integrated microfluidic check valve has a first chamber having inlet and outlet ports and divided by a barrier the said inlet and outlet ports into first and second subchambers. A membrane forms a wall of the first chamber and co-operates with the barrier to selectively permit and prevent fluid flow between the inlet and outlet ports. A second chamber adjoining the first chamber and has a wall formed by the membrane. A microfluidic channel establishes fluid communication between the second chamber and the first subchamber. The membrane deflects to permit fluid flow around the barrier when the pressure in the first subchamber is lower than the pressure in the second subchamber. Two such valves can be combined into a peristaltic pump.
    Type: Application
    Filed: August 2, 2011
    Publication date: February 7, 2013
    Applicant: TELEDYNE DALSA SEMICONDUCTOR, INC.
    Inventors: Robert Johnstone, Stephane Martel
  • Patent number: 8071486
    Abstract: A method of removing residues from an integrated device, in particular residues resulting from processing in HF vapor, is disclosed wherein the fabricated device is exposed to dry water vapor for a period of time sufficient to dissolve the residues in the dry water vapor.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: December 6, 2011
    Assignee: Teledyne Dalsa Semiconductor Inc.
    Inventors: Vincent Fortin, Jean Ouellet