Abstract: Apparatus for soldering printed circuit panels includes a roll configuration to convey the panels horizontally across a container carrying molten solder. The printed circuit panels are immersed in molten solder when they pass through the roll configuration. At least one air knife located at the output side of the roll configuration serves to level the molten solder on the panels as they exit from the rolls.

Abstract: A flexible jumper strip has rigid support members soldered to the pins formed by the ends of its leads in order to increase their mechanical strength. In making the jumper strip, conductor leads are formed on a conductor sheet laminated to a smaller insulator sheet so that the ends of the leads extend beyond the insulator to form termination pins. The rigid support members are registered over the pins by means of a lead frame and are then soldered to them.

Abstract: A flexible jumper strip has a V-shape for the ends of its leads in order to increase its mechanical strength. In one embodiment the ends of the leads are folded back to give even more strength. In making the jumper strip conductor leads are formed on a conductor sheet laminated to an insulator sheet. Then the lead ends are given a V-shape with a mechanical punching device.

Abstract: A method of making and electrically interconnecting layers of printed circuitry involves the steps of: (1) coating an insulator on both sides with an adhesive; (2) punching holes through the insulator at points where interconnections are to be made; (3) laminating conductor planes to both sides of the insulator by means of the adhesive; (4) forming printed circuit patterns on the conductors such that a proper conductor geometry is created at the points where the interconnections are to be made; (5) applying pre-punched, adhesive-coated cover layers of insulation over the exposed printed circuits, except in the area of the interconnections; and (6) applying solder to the conductor pattern. Since the geometry at the interconnections is carefully controlled a solder bridge is formed, which connects the two conductor patterns during step (6) by the flow of solder into the interconnection area, past the upper conductor, to the lower conductor.