Patents Assigned to Teledyne Rad-icon Imaging Corp.
  • Method of direct tiling of an image sensor array
    Patent number: 9012262
    Abstract: A method of making a tiled array of semiconductor dies includes aligning and flattening. One end of each semiconductor die has attached thereto a respective printed circuit board. The aligning aligns the semiconductor dies into the tiled array in such a way that the semiconductor dies rest on a vacuum plate and the one end of each die extends beyond an edge of the vacuum plate. The flattening flattens the semiconductor dies against the vacuum plate with a vacuum after the semiconductor dies are aligned.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: April 21, 2015
    Assignee: Teledyne Rad-icon Imaging Corp.
    Inventors: Farrier Michael George, Roumbanis John Bernard