Patents Assigned to Teledyne Rad-lcon Imaging Corporation
  • METHOD OF DIRECT TILING OF AN IMAGE SENSOR ARRAY
    Publication number: 20140035084
    Abstract: A method of making a tiled array of semiconductor dies includes aligning and flattening. One end of each semiconductor die has attached thereto a respective printed circuit board. The aligning aligns the semiconductor dies into the tiled array in such a way that the semiconductor dies rest on a vacuum plate and the one end of each die extends beyond an edge of the vacuum plate. The flattening flattens the semiconductor dies against the vacuum plate with a vacuum after the semiconductor dies are aligned.
    Type: Application
    Filed: April 17, 2012
    Publication date: February 6, 2014
    Applicant: Teledyne Rad-lcon Imaging Corporation
    Inventors: Farrier Michael George, Roumbanis John Bernard