Abstract: An apparatus comprising a buffer estimation module for estimating if a base station has data buffered for a mobile communication device is provided. The apparatus further comprises a scheduling estimation module for determining how frequently the mobile communication device has been scheduled to receive data from the base station, a radio quality module for determining a radio quality indication of a communication channel between the mobile communication device and the base station, and a throughput estimation module for predicting downlink throughput from the base station to the mobile communication device based on at least output from the buffer estimation module, the frequency estimation module and the radio quality module.

Abstract: The invention provides a quality of service monitoring device (12) for use with a user equipment comprising a base platform (14); and an external communication module (24) adapted to receive from an external source one or more listener modules and/or detector modules for incorporation into the base platform (14). The base platform (14) is coupled to the external communication module (24) to receive one or more listener modules (20) and detector modules (22) and is adapted to install received modules to extend the functionality of the base platform (14) so as to perform the functionality of the installed modules. A corresponding method is provided. There is also provided a quality of service monitoring apparatus, for use on the network side, as well as a corresponding method.

Abstract: In a method and a device for controlling the output power in a Base Transceiver Station adapted to transmit signals over an air interface using a power amplifier for multiple earners, the power of signals to be transmitted in an upcoming transmission time slot are added and compared to at least one threshold value. If the threshold is exceeded the output power is reduced. By implementing a power reduction scheme as set out above the risk for peak power effects is minimized at the same time as the dimensioning may be aggressive. This is made possible because no power will be backed off unless really needed.

Abstract: A semiconductive chip having at least one active device, and at least one bond pad located on said active device. The bond pad has at least one deformable member, and the deformable member is deformable when conductive stud is bonded to said bond pad so as to prevent damage to the active device during the bonding of the conductive stud to the bond pad, such as by an ultrasonic bonding technique. A plurality of the deformable members may define a pattern on the bond pad that deforms when the conductive stud is bonded to the bond pad.

Abstract: In a system having a master device coupled to a slave device by means of an interface, wherein a function of the master device includes downloading a control program to the slave device, an apparatus for providing the master device with capability information corresponding to the slave device has hardware for reading the capability information from a predefined portion of the control program, and hardware for storing the capability information for use by the master device during a communications operation with the slave device. An encoding scheme for the capability information permits new functions to be added without having to re-encode pre-existing information corresponding to pre-existing slave devices. The capability information is encoded as a first vector and a second vector. A new function that is supported by a new slave device is added to the first vector when the new function is not supported by any pre-existing slave device.