Abstract: A remote monitoring system includes transducers, a transducer control module, a communications device, a monitoring system and end-user display terminals. The transducers are disposed on the property and/or equipment in a manner to measure specific characteristics or parameters and communicate with the transducer control module via a wireless communication protocol. The transducer control module receives and analyzes transducer measurements and detects alarm conditions. The transducer control module communicates with the monitoring system via a wide area network and the communications device. The monitoring system receives, stores and analyzes information received from the transducer control module and reports the information to the end-user terminals via a wide area network, such as the Internet, in response to user requests.

Abstract: A transducer assembly for connection with a digital signal processing system includes an analog transducer, a digital connector assembly movable relative to the analog transducer to facilitate connection with the digital signal processing system, and a cable permanently affixed between the analog transducer and the digital connector assembly to convey an analog transducer signal therebetween. The digital connector assembly includes a connector housing, a digital connector mounted by the connector housing to mate in a detachable manner with the digital signal processing system, and transducer interface circuitry disposed within the connector housing in a non-removable manner and including a digital storage device programmed to store digital transducer data, such as transducer identification, configuration settings and calibration or correction factors, for retrieval by the digital signal processing system. The transducer interface circuitry can also include signal conditioning circuitry and a microcontroller.

Abstract: A smart sensor module includes a microcontroller and a signal conditioning integrated circuit. In a preferred embodiment, the signal conditioning integrated circuit is a mixed signal application specific integrated circuit (ASIC) incorporating an instrumentation amplifier, offset correction, sensitivity correction, low pass filtering, an analog-to-digital converter (ADC), a temperature sensor, digital I/O interface, a crystal oscillator circuit, and power on reset open collector output. The ADC can be multiplexed to the transducer, the temperature sensor or an external input. All features of the ASIC can be dynamically reconfigured at any time by the microcontroller. Offset correction is implemented with a 4-bit coarse adjustment digital-to-analog converter (DAC) and a 7-bit fine adjustment DAC to control the instrumentation amplifier reference voltage.