Abstract: Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½– 3/2 of the second height.

Abstract: Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½- 3/2 of the second height.

Abstract: Provided are an anisotropic conductive adhesive (ACA) for a fine pitch including conductive particles and non-conductive particles, and a chip-on-glass (COG) packaged liquid crystal display (LCD) module including the ACA. The sizes of the conductive particles and non-conductive particles in the ACA are adjusted according to a gap between electrodes of fine pitch arranged on a glass substrate of the LCD module. The provided ACA for a fine pitch is used for connecting the IC onto the glass substrate such as to electrically connect the IC to the electrodes.

Abstract: Provided are an optical module used in a high-frequency optical communication system, and an optical receiver module, an optical transmitter module, and an optical repeater module for receiving, transmitting, and repeating an optical signal in a high frequency band. The optical module includes a silicon substrate, the optical fiber, devices, a signal transmission line, and an oxidized porous silicon layer. In the silicon substrate, a V-shaped guide groove for arranging an optical fiber is formed. The optical fiber is installed in the V-shaped guide groove and used as a path through which an optical signal is input or output. The devices are mounted on the silicon substrate to receive, transmit, or repeat the optical signal. The signal transmission line electrically connects the devices. The oxidized porous silicon layer is formed at least between the silicon substrate and the devices to prevent signal loss.

Abstract: The method of the present invention comprises the steps of: providing an IC chip having I/O pads, each having a non-solder bump such as Au or Cu stud bump or Ni\Cu\Au bump formed thereon, and a substrate having metal electrodes formed thereon; applying a film-type non-conductive adhesive (NCA) to the chip or substrate, the adhesive including solid-phase bisphenol A type epoxy resin, liquid-phase bisphenol F type epoxy resin, solid-phase phenoxy resin, methylethylketone/toluene solvent, liquid-phase hardener, and non-conductive particles; and thermo-compressing the IC chip to the substrate so that the non-solder bump and the metal electrode can be mechanically and electrically connected. The NCA of the present invention has high reliability since it has lower thermal expansion coefficient and dielectric constant than conventional NCAs and has excellent mechanical and electrical characteristics.