Patents Assigned to Temco Japan Co., Ltd.
  • Publication number: 20190174233
    Abstract: Provided is a bone conduction speaker unit with which the possibility of adsorption of fine iron powder and dirt and dust, entrance of moisture, or the like, has been eliminated, and further the level of the sound leakage from the bone conduction speaker unit as a single element is satisfactorily low over a frequency range that is crucial for good sound transmission using a bone conduction speaker. The bone conduction speaker unit is of magnetic type, having a bone conduction speaker being housed in a unit casing the top of which is opened, with a contact plate for vibration transmission being disposed above a diaphragm of the bone conduction speaker, the top opening of the unit casing being blocked with an elastic membrane that is breathable.
    Type: Application
    Filed: March 23, 2018
    Publication date: June 6, 2019
    Applicant: Temco Japan Co., Ltd.
    Inventor: Mikio FUKUDA
  • Patent number: 9930436
    Abstract: A bone conduction speaker is provided that, while it is a bone conduction speaker, additionally has a structure allowing a respiratory tract sound to be generated, thereby the high frequency characteristics thereof being improved. In the case where it is used by a hearing non-impaired person, communications at a good voice level can be made as well as in the case where it is used by a hearing impaired person. Further, when the hearing non-impaired person uses it to listen to a music, the music can be enjoyed with a high sound quality.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: March 27, 2018
    Assignee: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Patent number: 9532135
    Abstract: Problem is to provide a bone conduction speaker unit which is compact as a whole, and can be used, being simply and neatly mounted to a great variety of pieces of existing communication equipment, such as mobile phones. A unit case 1 is provided which incorporates a bone conduction speaker 2 such that a diaphragm 3 is exposed, with an earphone-jack mating plug 4, which is connected to the bone conduction speaker 2, being disposed on the unit case 1, and by connecting the plug 4 to an earphone jack 22 on a cabinet 21 of a piece of communication equipment, such as a mobile phone, the piece of communication equipment is allowed to be used as a speaker.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: December 27, 2016
    Assignee: TEMCO JAPAN CO., LTD
    Inventors: Takeshi Takeda, Yasuhide Terasawa
  • Patent number: 9532123
    Abstract: Provided is a bone conduction speaker unit which can sufficiently prevent generation of sound leakage at non-calling. The bone conduction speaker unit includes a bone conduction speaker main body, being incorporated in a housing with an elastic base being interposed, an elastic cover being mounted on a top face of the housing. Bonding between a rear face of the bone conduction speaker main body and a top face of the elastic base, and/or bonding between the elastic base and an inner bottom face of the housing are partially made; upon the elastic cover having been mounted on the housing, a gap is held between an internal top face of the elastic cover and a top face of the bone conduction speaker main body; and with the elastic cover being pressed in use, the internal top face thereof is abutted against the top face of the bone conduction speaker main body.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: December 27, 2016
    Assignee: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Patent number: 9451357
    Abstract: A basal end cover having a cable entry portion, and an earphone case which accommodates a bone conduction microphone and a bone conduction speaker, being assembled to the basal end cover, with the earphone case including a rigid resin ear plug having a microphone accommodating space in which the bone conduction microphone to be disposed on the distal end side is accommodated, and a speaker accommodating space in which the bone conduction speaker to be disposed on the basal end side is accommodated, and a sensing cover formed of a material softer than that of the ear plug defining the microphone accommodating space, and a bone-conducted sound is picked up by the bone conduction microphone through the sensing cover is provided.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: September 20, 2016
    Assignee: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Patent number: 9253563
    Abstract: Problem: To provide a bone conduction speaker unit which can sufficiently prevent generation of sound leakage at the time of non-calling, and can be easily incorporated in a main body casing of mobile phones, and the like. Solution: A bone conduction speaker unit, being configured by incorporating a bone conduction speaker main body 2 in a housing 1, wherein an elastic plate 21 is fixed on a top face of a plate yoke 17 of the bone conduction speaker main body 2; an elastic base 22 is disposed on a rear face of a yoke 11; and an elastic cover 3 for holding a contact 5 which, upon a pressing force having been applied thereto in use, is abutted against the plate yoke 17 through the elastic plate 21 is loaded on the housing 1 with a gap “a” being held between a bottom face of the contact 5 and a top face of the elastic plate 21.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: February 2, 2016
    Assignee: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Publication number: 20140348346
    Abstract: A basal end cover having a cable entry portion, and an earphone case which accommodates a bone conduction microphone and a bone conduction speaker, being assembled to the basal end cover, with the earphone case including a rigid resin ear plug having a microphone accommodating space in which the bone conduction microphone to be disposed on the distal end side is accommodated, and a speaker accommodating space in which the bone conduction speaker to be disposed on the basal end side is accommodated, and a sensing cover formed of a material softer than that of the ear plug defining the microphone accommodating space, and a bone-conducted sound is picked up by the bone conduction microphone through the sensing cover is provided.
    Type: Application
    Filed: January 15, 2013
    Publication date: November 27, 2014
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Publication number: 20140274229
    Abstract: One surface of a housing is furnished with an opening larger in diameter than a bone conduction device placed therein. A cushioning material is arranged on the inside surface of the opening, and an abutting member secured to a plate yoke constituting the bone conduction device is supported on the cushioning material, such that the top surface thereof is positioned slightly above the surface of the housing. The cushioning material is an annular disk in which is formed a center hole slightly smaller in diameter than the outside diameter of the bone conduction device. The outside peripheral half of the cushioning material is secured resting on the upper edge of the opening of the housing, and the outside edge of the abutting member is secured resting on the upper edge of the center hole of the cushioning material.
    Type: Application
    Filed: October 18, 2012
    Publication date: September 18, 2014
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Patent number: 8675897
    Abstract: It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: March 18, 2014
    Assignee: Temco Japan Co., Ltd.
    Inventors: Mikio Fukuda, Tomoya Atsumi, Shouji Fujino
  • Patent number: 8416978
    Abstract: [Problem to be Solved] To provide a high-sensitive compact vibration pickup microphone, suitably used as a talking microphone in high ambient noise environments or as a speech recognition input microphone, with high microphone sensitivity, resistance to sliding noise, and insensitivity to external noise and vibration.
    Type: Grant
    Filed: February 28, 2008
    Date of Patent: April 9, 2013
    Assignee: Temco Japan Co., Ltd.
    Inventor: Mikio Fukuda
  • Patent number: 7983431
    Abstract: The object is to provide a bone conduction device and its tympanum, wherein the bone conduction device can be efficiently mounted without generating a dead space in a case having a limited installation space such as a cellular phone's case having a large display screen. A magnetic sound converter device has an outer magnetic structure wherein a voice coil (3) is mounted on a center magnetic pole (2) of a yoke (1) and a magnet (4) is arranged on the outer side of the voice coil (3). The yoke (1) and the center magnetic pole (2) thereof are vertically long, the magnet (4) is arranged on the short side edge parts on the both sides of the yoke, and a tympanum fixing part (6) is arranged on the outer side of each magnet (4) on a magnet arrangement axis.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: July 19, 2011
    Assignee: Temco Japan Co., Ltd,
    Inventor: Mikio Fukuda
  • Publication number: 20110170718
    Abstract: It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.
    Type: Application
    Filed: September 2, 2009
    Publication date: July 14, 2011
    Applicant: TEMCO JAPAN CO., LTD.
    Inventors: Mikio Fukuda, Tomoya Atsumi, Shouji Fujino
  • Patent number: 7965244
    Abstract: To provide a compact and comparatively low-priced connector for a hand microphone with an antenna capable of firmly connecting to an antenna port and a UC port with high waterproofness and minimizing the attenuation of the antenna output. A connector 1 for leading an antenna output from an antenna port 4 to a hand microphone with an antenna includes an adapter 8 attached to the antenna port 4, and a connector body 7 having a swingable cap 26 engageable with the adapter 8 and a portion to be connected to the UC port 5. The adapter 8 has in its lower portion an antenna port connection terminal to be connected to the antenna port 4 and has in its upper surface a connector body connection terminal which contacts a contact pin projecting from an inner bottom surface of the swingable cap 26 and connected to the antenna of the hand microphone.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: June 21, 2011
    Assignee: Temco Japan Co., Ltd.
    Inventor: Jiro Nawa
  • Publication number: 20100329485
    Abstract: To provide a bone conduction speaker that enables a wearer to hear a bone-conducted sound and an air-conducted sound caused by the bone-conducted sound to improve the quality and depth of the sound and allows the wearer to hear external sounds to improve the safety in outdoor use, and a hearing device using the same. When a bone conduction speaker is fitted in an auricle, a part 4, 5 or 6 of a main body 1 of the bone conduction speaker abuts against the entrance and/or the periphery of the entrance of the external auditory meatus to conduct a vibration of the entrance and/or the periphery of the entrance of the external auditory meatus, and a sound pressure caused by the vibration of the entrance and/or the periphery of the entrance of the external auditory meatus conducted by the abutting part is transmitted to the tympanic membrane through the external auditory meatus.
    Type: Application
    Filed: March 17, 2009
    Publication date: December 30, 2010
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Publication number: 20100290660
    Abstract: To provide a microphone used for telecommunication or speech recognition input in a high noise environment, or more specifically, a vibration pickup microphone that hardly howls even when transmission and reception occur simultaneously. A vibration pickup microphone has: a housing 1 attached to a human body contact surface of a transmitter/receiver or the like; a microphone unit 2 of an aerial vibration collecting type incorporated in the housing 1; and a microphone holder 5 that is made of an elastic material and supports the microphone unit 2 in the housing 1. The housing 1 has a case 3 having an opening in an upper surface thereof, in which the microphone holder 5 is fitted, and a cover 4 that is made of an elastic material and covers an outer surface of the case 3. A multilayered diaphragm 6 is disposed on an upper surface of the microphone holder 5 with an air space 16 formed between the multilayered diaphragm 6 and the microphone holder 5.
    Type: Application
    Filed: February 6, 2009
    Publication date: November 18, 2010
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Publication number: 20100266140
    Abstract: An object of the invention is to provide a voice input/output automatic switching circuit used in a hand-held microphone with speaker of a communication device such as a transceiver. In the voice input/output automatic switching circuit, a circuit for detecting a handsfree speaker/microphone can be simply configured without requiring a particular detection terminal and moreover, a sufficient countermeasure can be taken against a malfunction caused upon its switching.
    Type: Application
    Filed: November 26, 2008
    Publication date: October 21, 2010
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Shouji Fujino
  • Publication number: 20100119086
    Abstract: [Problem to be Solved] To provide a high-sensitive compact vibration pickup microphone, suitably used as a talking microphone in high ambient noise environments or as a speech recognition input microphone, with high microphone sensitivity, resistance to sliding noise, and insensitivity to external noise and vibration.
    Type: Application
    Filed: February 2, 2008
    Publication date: May 13, 2010
    Applicant: TEMCO JAPAN CO., LTD.
    Inventor: Mikio Fukuda
  • Patent number: 7639825
    Abstract: The object is to provide a bone-conduction handset, which has its main body (1) sufficiently isolated from a bone-conduction speaker unit (3) so that: the chances that howling and sound leaking may occur are reduced; and, the handset is improved in easiness in use. In the handset, the speaker unit (3) is mounted on the main body (1) through a speaker mounting member (2) made of a vibration-proof material. The mounting member (2) is characterized by comprising a connection portion (6), which is disposed perpendicularly to both the handset body (1) and the speaker unit (3) in a manner such that the main body (1) and the speaker unit (3) have their opposed inner surfaces disposed adjacent to opposite sides of the connection portion (6), whereby the main body (1) is isolated from the speaker unit (3).
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: December 29, 2009
    Assignee: Temco Japan Co., Ltd.
    Inventor: Mikio Fukuda
  • Publication number: 20090290730
    Abstract: A bone conductive speaker in which the hearing of external sounds is not inhibited because the earhole is not closed, the hearing efficiency is high and the sound leakage is small because the tragus portion is vibrated locally, and moreover the configuration is simple and the putting-on and taking-off operations are easy to perform. The bone conductive speaker comprises a bone conductive speaker body (1) and holding means (2) which is attached to the bone conductive speaker body (1) to hold the bone conductive speaker body (1) so that the bone conductive speaker body (1) is brought into contact with the tragus (31) or a portion in the vicinity thereof. The holding means (2) is of a ring shape having a size accommodated in the concha cavity (30), and both outside face parts thereof come into contact with the inside portion of the tragus (31) and the inside surface of the concha cavity (30) to continuously push them, by which the holding means (2) is locked at that position.
    Type: Application
    Filed: September 6, 2007
    Publication date: November 26, 2009
    Applicant: TEMCO JAPAN CO., LTD.
    Inventors: Mikio Fukuda, Takeshi Takeda
  • Patent number: 7512425
    Abstract: A portable telephone using a bone conduction speaker, enabling production of high output without any increase in thickness of a housing of a telephone body and having no problem in use in a noisy environment. In the telephone: a bone conduction speaker (1) is used as a speaker; a concave portion (3) having a diameter larger than that of the bone conduction speaker (1) is provided in a housing (2) of a telephone body; a cushioning material (4) is installed between the inner surface of the concave portion (3) and the outer surface of the bone conduction speaker (1); the bone conduction speaker (1) is supported on the cushioning material (4) to provide a gap between the speaker and the bottom of the depression (3); and, the vibration surface of the speaker is flush with or slightly extended outward from the surface of the housing (2).
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: March 31, 2009
    Assignee: Temco Japan Co., Ltd.
    Inventor: Mikio Fukuda