Patents Assigned to Tempia Co., Ltd.
  • Patent number: 6865904
    Abstract: The present invention relates to a combined regeneration cooling and heating system capable of enhancing a heat exchange efficiency based on a heat exchange between a high temperature refrigerant flowing in the interior of an expansion unit and a low temperature refrigerant flowing in the outside.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 15, 2005
    Assignee: Tempia Co., Ltd.
    Inventor: Hwa-Sik Wang
  • Publication number: 20040159117
    Abstract: The present invention relates to a combined regeneration cooling and heating system capable of enhancing a heat exchange efficiency based on a heat exchange between a high temperature refrigerant flowing in the interior of an expansion unit and a low temperature refrigerant flowing in the outside.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 19, 2004
    Applicant: TEMPIA CO., LTD.
    Inventor: Hwa-Sik Wang