Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.
Type:
Grant
Filed:
October 16, 2019
Date of Patent:
April 26, 2022
Assignee:
Tempo Automation, Inc.
Inventors:
Jeffrey McAlvay, Shannon Lincoln, Jesse Koenig, Thomas Anderson, Jonas Neubert, Shashank Samala, Ryan Saul
Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.
Type:
Grant
Filed:
January 5, 2018
Date of Patent:
November 19, 2019
Assignee:
Tempo Automation, Inc.
Inventors:
Jeffrey McAlvay, Shannon Lincoln, Jesse Koenig, Thomas Anderson, Jonas Neubert, Shashank Samala, Ryan Saul
Abstract: A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.
Type:
Grant
Filed:
March 21, 2017
Date of Patent:
May 15, 2018
Assignee:
Tempo Automation, Inc.
Inventors:
Jeffrey McAlvay, Shannon Lincoln, Jesse Koenig, Thomas Anderson, Jonas Neubert, Shashank Samala, Ryan Saul