Abstract: A polycrystalline diamond cutting element has a non-planar, non-linear interface between a substrate and a table. The substrate has one or more protrusions mounted on the surface of the substrate and in spaced relationship. Each protrusion has a generally curved shape such as a delta or triangular shape that extends from the center of the substrate toward the perimeter of the substrate. The depth of the groove between protrusions generally increases along the path toward the perimeter of the element. Similarly, the depth of each protrusion from groove to groove varies along the path toward the perimeter of the element. A thicker, superhard layer such as a diamond layer is provided toward the circle of the element to increase working life. The resulting cutting element is symmetrical about the central axis to alleviate the need for proper orientation of the cutting element during assembly into a drill bit. In another embodiment, a depression is used in place of the protrusion to form a substrate.

Abstract: A cutting compact has a superhard abrasive layer bonded to a substrate layer, wherein the configuration of the interface between abrasive and substrate layers is a non-planar, or three dimensional, interface which increases the surface area between the layers available for bonding and optimizes the structural integrity of the compact according to its desired application. In one embodiment, the topography between the substrate and abrasive layers of the compact is characterized by interlocking concentric circular grooves and channels of varying width, depth and shape. In another embodiment, the interface between the grooves and channels is rounded and smooth. In additional embodiments, the grooves and channels are positioned on substantially angled interfaces or substantially curved interfaces. Additional configurations of the present invention provide that the grooves alternatingly start and stop along the path in interfacing with their respective channels.