Abstract: A device under test cooling system has a refrigerant line and a fluid line extending through a plurality of successively arranged heat exchangers. A digital scroll compressor has an intake for providing the refrigerant mixture to the compressor and a discharge connecting the compressor to the refrigerant line to provide the refrigerant mixture to the heat exchangers. The compressor includes a plurality of scroll elements between the intake and the discharge for compressing the refrigerant mixture. The compressor includes a valve configured to separate the scroll elements when in an open position to allow refrigerant to flow freely between the intake and the discharge. When the valve is in a closed position, the scroll elements compress the refrigerant. A controller is configured to switch the valve between an open and closed position based on a set duty cycle.

Abstract: A temperature control system includes a fluid chiller, an air dryer, and a plurality of test stations positioned at remote locations from the fluid chiller and the air dryer. The fluid chiller is configured to generate a chilled fluid stream. The air dryer is configured to generate a dry air stream. Each local test station includes a heat exchanger and thermal control unit. The heat exchanger is configured to selectively cool the dry air stream with the chilled fluid stream to generate an output stream. The thermal control unit is configured to control distribution of the output stream to a local test site.

Abstract: A temperature-controlled fluid processing system with accessory attachment mechanism includes an accessory annular ring feature a mounting surface and a tapered surface sloping toward a central axis of the ring feature and away from the mounting surface, and engaging components on the primary device, including concentric annular member and rotation plate. The annular member includes spaced apart through holes housing spring biased pins. The rotation plate surrounds the annular member, and includes one or more ramped inner surface(s). The plate is rotatable between an unattached position wherein the ramped surfaces apply no radial inward force to the spring-biased pins, and an attached position wherein each ramped surface displaces a pin inward through its corresponding through hole such that the conical tip of the spring-biased pin engages the tapered surface of the ring feature, thereby immobilizing the accessory with respect to a head unit of the fluid processing device.

Abstract: A device under test cooling system has a refrigerant line and a fluid line extending through a plurality of successively arranged heat exchangers. A digital scroll compressor has an intake for providing the refrigerant mixture to the compressor and a discharge connecting the compressor to the refrigerant line to provide the refrigerant mixture to the heat exchangers. The compressor includes a plurality of scroll elements between the intake and the discharge for compressing the refrigerant mixture. The compressor includes a valve configured to separate the scroll elements when in an open position to allow refrigerant to flow freely between the intake and the discharge. When the valve is in a closed position, the scroll elements compress the refrigerant. A controller is configured to switch the valve between an open and closed position based on a set duty cycle.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat exchanger, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes contact with a device under test (DUT), heat is conducted to or from DUT.

Abstract: A temperature-controlled fluid processing system with accessory attachment mechanism includes an accessory annular ring feature a mounting surface and a tapered surface sloping toward a central axis of the ring feature and away from the mounting surface, and engaging components on the primary device, including concentric annular member and rotation plate. The annular member includes spaced apart through holes housing spring biased pins. The rotation plate surrounds the annular member, and includes one or more ramped inner surface(s). The plate is rotatable between an unattached position wherein the ramped surfaces apply no radial inward force to the spring-biased pins, and an attached position wherein each ramped surface displaces a pin inward through its corresponding through hole such that the conical tip of the spring-biased pin engages the tapered surface of the ring feature, thereby immobilizing the accessory with respect to a head unit of the fluid processing device.

Abstract: A temperature control system for controlling a temperature of a device under test includes a fluid source and a cooling device reducing a temperature of the fluid supplied by the fluid source and outputting the fluid having the reduced temperature to a device under test. A filter is positioned between the device under test and the cooling device to filter out ice particles that lead to significant charge generation in order to prevent the device under test from being subjected to high voltages as a result of static charge generation.

Abstract: An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: An environmental chamber system and a method for testing a device under test (DUT) include an environmental chamber in which the DUT can be tested. A temperature sensor senses temperature of the DUT, the temperature sensor generating a signal indicative of temperature of the DUT. A controller receives at least one input signal related to at least one of temperature and humidity in the chamber and the signal indicative of temperature of the DUT and provides at least one control signal for adjusting at least one of temperature and humidity in the chamber, such that the temperature of the DUT is not below a dew point of an environment in the chamber in a region of the chamber near the DUT, such that condensation in the environment in the chamber in the region near the DUT does not occur.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: An apparatus and method of controlling the temperature of a thermal chuck system are disclosed. The system includes a temperature controller which controls a temperature transition in a thermal chuck. The temperature controller comprises inputs that receive air and fluid from an air source and water source, respectively, and an output for alternately transferring the air and fluid in proportions to the thermal chuck. A time proportional controller generates the proportions by computing a proportion band in each of a plurality of control regions. The proportion bands are used by the temperature controller to manage the flow of air and fluid to the chuck such that a minimum undershoot of the temperature transition is realized.

Abstract: An apparatus and method of controlling the temperature of a thermal chuck system are disclosed. The system includes a temperature controller which controls a temperature transition in a thermal chuck. The temperature controller comprises inputs that receive air and fluid from an air source and water source, respectively, and an output for alternately transferring the air and fluid in proportions to the thermal chuck. A time proportional controller generates the proportions by computing a proportion band in each of a plurality of control regions. The proportion bands are used by the temperature controller to manage the flow of air and fluid to the chuck such that a minimum undershoot of the temperature transition is realized.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

Abstract: A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.

Abstract: A system and method for controlling temperature in a workpiece chuck are described. A fluid circulation system circulates a temperature control fluid, such as an engineered HFE fluid, through te workpiece chuck. A fluid recovery system coupled to the fluid circulation system recovers a portion of the temperature control fluid from the fluid circulation system by circulating a gas through the fluid circulation system including fluid tubes and fluid passages in the chuck. The gas, which can be air, carries a portion of residual or excess fluid through the fluid circulation system as it is circulated. The residual fluid is carried back to a reservoir such that it can continue to be used to control temperature of the chuck. Where gas and temperature control fluid vapors are displaced from the reservoir, they are routed through a suction line heat exchanger which condenses the vapor. The gas and condensed fluid are separated in a fluid separator.