Patents Assigned to Terachip Inc.
  • Patent number: 6934924
    Abstract: A new simple novel Layout methodology for high integration VLSI chip is proposed, which is reduced dramatically the complexity, the cost and the schedule for implementing a complex chip such as System On a Chip (SOC) that required hierarchical layout implementation. A set of rules is provided for the place and route process.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: August 23, 2005
    Assignee: Terachip Inc.
    Inventors: Gideon Paul, Evgeny Grigoryantz
  • Publication number: 20040153985
    Abstract: A new simple novel Layout methodology for high integration VLSI chip is proposed, which is reduced dramatically the complexity, the cost and the schedule for implementing a complex chip such as System On a Chip (SOC) that required hierarchical layout implementation. A set of rules is provided for the place and route process.
    Type: Application
    Filed: May 30, 2003
    Publication date: August 5, 2004
    Applicant: TERACHIP INC.
    Inventors: Gideon Paul, Evgeny Grigoriants
  • Publication number: 20030056073
    Abstract: A method and system that provides a high processing speed and an efficient memory usage scheme includes multiple logical queues within a single physical memory. For each port of a memory device, a physical memory having slices, a free physical slice address list, and logical queues corresponding to a quality of service (QoS) classes are provided. Each logical queue includes a read pointer and a write pointer, such that a respective read and/or write operation can be performed in accordance with a logical decision that is based on an input. The logical queues manage the physical memory so that reading and writing operations are performed based on availability of free physical slices, as well as QoS. The present invention also manages reading and writing operation when all physical slices in a physical memory are filled, as well as wrap-around and jumping between physical memories.
    Type: Application
    Filed: September 18, 2001
    Publication date: March 20, 2003
    Applicant: TeraChip, Inc.
    Inventor: Micha Zeiger