Abstract: A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AlSb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.

Abstract: An optoelectric device can comprise a substrate and at least one junction configured to provide an active region within the substrate. Additionally, the device can comprise a metal-mesh semiconductor electrical contact structure attached to a surface of the substrate. The metal-mesh semiconductor electrical contact structure can further comprise a mesh line width, a mesh opening size, and a mesh thickness.

Abstract: A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AISb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.

Abstract: Methods for fabricating mid-infrared light emitting diodes (LEDs) based upon antimonide-arsenide semiconductor heterostructures and configured into front-side emitting high-brightness LED die and other LED die formats.

Abstract: Optoelectric devices that comprise a semiconductor superlattice heterostructure. One or more individual layers within the semiconductor superlattice heterostructure can further comprise layers of differing thicknesses. In at least one embodiment, an optoelectric device with specially engineered layers can generate an output wavelength of between 3 ?m to 15 ?m at output power levels of 0.01 mW to 100 mW.

Abstract: A light emitting diode (LED) with weakly-coupled dielectric buttes deposited along the surface is disclosed. The buttes improve light extraction from a distributed volume of incoherent sources in a high-index substrate, as well as from light backscattered by a rear metallic contact. A lattice arrangement for the buttes maximizes area coverage, subject to the constraint of weak evanescent wave coupling between them. The butte distribution may be fabricated by epitaxial deposition above a current spreading layer, followed by photolithographic patterning and etching.