Abstract: Provided is a serial-type planar heat-generating heater and a manufacturing method thereof. In particular, the present invention relates to a serial-type planar heat-generating heater, which is capable of maximizing the effect of heating by minimizing dead zones in which heat is not generated, achieving a maximum power output in a limited area, unlike in a parallel-type heater, and achieving high temperature uniformity in all of heat-generating surfaces of the planar heat-generating heater, is easy to design to control heating performance, and may be manufactured at low costs; and a manufacturing method thereof.

Abstract: The present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom. Specifically, the present invention relates to a heating element composition capable of three-dimensional molding and a film heater formed therefrom, wherein the heating element composition has high extensibility and excellent high temperature durability which is in a conflicting relationship with extensibility, so that mechanical damage such as cracks during stretching can be suppressed, has the characteristic of being stably maintained in a molded shape rather than being restored to an original shape after molding, like conventional stretchable materials, can minimize the change rate of resistance when deformed by three-dimensional molding, can be cured at 150° C. or less, and can form a heating element by various printings or coatings so as to be applied to various film heaters.

Abstract: Disclosed is a chip bonding composition for a power semiconductor package, which, by comprising an epoxy resin including glycidyl amine-based epoxy resin and bisphenol A type epoxy resin, a glycidyl ether-based diluent, and a polysilsesquioxane (PSQ) resin, has high thermal conductivity and adhesion, high heat dissipation characteristics, and low modulus characteristics. The chip bonding composition according to the present invention comprises: silver powder; an epoxy resin; a curing agent; a catalyst; a glycidyl ether-based diluent; and a PSQ resin.

Abstract: Provided is a serial-type planar heat-generating heater and a manufacturing method thereof. In particular, the present invention relates to a serial-type planar heat-generating heater, which is capable of maximizing the effect of heating by minimizing dead zones in which heat is not generated, achieving a maximum power output in a limited area, unlike in a parallel-type heater, and achieving high temperature uniformity in all of heat-generating surfaces of the planar heat-generating heater, is easy to design to control heating performance, and may be manufactured at low costs; and a manufacturing method thereof.