Patents Assigned to Terdyne, Inc.
  • Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies
    Patent number: 7388158
    Abstract: In one embodiment, a substrate assembly includes a flat substrate having oppositely disposed planar surfaces and a conductor. The conductor is formed on at least one of the planar surfaces and defines a conductor plane. The structure further includes an oversized-in-diameter anti-pad formed through the substrate layer and the conductor layer. The anti-pad further includes a dielectric spacer formed substantially coplanar with the conductor plane.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: June 17, 2008
    Assignee: Terdyne, Inc.
    Inventors: Yeong Joo Yoon, Fernando Aguirre, Nicholas Teneketges