Abstract: A method of making a combined printed circuit board having a hollow portion or a through hole and an integrated circuit driver, wherein an external surface of the board and the driver is substantially planar. The method comprises steps of mounting the driver in the hollow portion, providing means temporarily for holding the driver in the hollow portion, encapsulating resin the driver with resin, and then removing the temporarily holding means.
Type:
Grant
Filed:
November 22, 1996
Date of Patent:
July 13, 1999
Assignees:
Varintelligent (BVI) Limited, Terrence Leslie Johnson