Patents Assigned to Tesec Corporation
  • Patent number: 9520316
    Abstract: A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: December 13, 2016
    Assignee: TESEC Corporation
    Inventor: Takashi Kurakane
  • Publication number: 20150083344
    Abstract: A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet.
    Type: Application
    Filed: September 22, 2014
    Publication date: March 26, 2015
    Applicant: TESEC Corporation
    Inventor: Takashi Kurakane
  • Patent number: 8294481
    Abstract: A handler includes a table which supports an electronic device, a socket which is arranged to face the table, and a transport mechanism which transports the electronic device. The transport mechanism includes a contact head having a lead press with a recess for storing the electronic device, and a chuck sleeve which extends through the lead press, is arranged relatively movable from the lead press in a direction in which the chuck sleeve extends, and chucks the electronic device, an elevating mechanism which moves the contact head between the table and the socket, a pivot mechanism which pivots the contact head within the vertical plane, and a control unit which controls chucking and release of the electronic device by the chuck sleeve, and vertical movement and pivot of the contact head.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: October 23, 2012
    Assignee: Tesec Corporation
    Inventors: Susumu Akahoshi, Michio Kato
  • Patent number: 5743749
    Abstract: In an electronic component connector, terminals are formed on a measurement circuit board. Support members are provided on the measurement circuit board to correspond to the terminals. The support members respectively have free end portions arranged in a row to correspond to a plurality of lead terminals extending from an electrical component and proximal end portions cantilevered by the measurement circuit board. Contacts are insulated from each other and provided to the free end portions of the support members to normally oppose the terminals through a predetermined gap. The contacts respectively have first contact portions to come into contact with the lead terminals of the electrical component and second contact portions to come into contact with the terminals at positions, in a longitudinal direction of the support members, different from positions where the first contact portions come into contact with the terminals.
    Type: Grant
    Filed: November 15, 1996
    Date of Patent: April 28, 1998
    Assignee: Tesec Corporation
    Inventor: Takashi Kurakane