Abstract: During the semiconductor testing process, in order to decrease a temperature difference between a predetermined temperature and a measured temperature, the present disclosure provides a wafer probing testing apparatus and a final testing apparatus for semiconductor testing. The wafer probing testing apparatus comprises a printed circuit board, a probe head, a heater, a thermal sensor and a thermal controller. The final testing apparatus comprises a printed circuit board, a socket, a heater, a thermal sensor and a thermal controller. Due to the arrangement of the thermal sensor, the heater and the thermal controller, the temperature difference of the predetermined temperature may be decreased, and the cost during the semiconductor testing can also be reduced.