Abstract: An apparatus for depositing a metal film on a surface of a three-dimensional object, includes a mounting drum rotatably disposed inside a chamber and having a circumferential surface onto which a plurality of three-dimensional objects is settled and mounted making each surface thereof to be subjected to deposition be exposed to an outside; and at least one source target depositing a metal film onto the surface of the three-dimensional object mounted to the mounting drum by sputtering.

Abstract: Disclosed is a deposition apparatus for a substrate, in particular, a deposition apparatus for both lateral portions of a substrate, in which at least one substrate is inserted in and mounted to a revolvably disposed substrate mounting drum in a direction from an outside circumferential surface toward an inside circumferential surface, one lateral portion of the substrate exposed protruding from an inside circumferential surface is subjected to deposition based on an inside source target, and the other lateral portion of the substrate exposed protruding from an outside circumferential surface is subjected to deposition based on an outside source target, thereby depositing wiring to both lateral portions of the substrate at once, and achieving a three-dimensional (3D) deposition improved in uniformity and quality.

Abstract: Disclosed is a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.

Abstract: The disclosure relates to an LED display module, and more particularly to an LED display module, in which a conductive metal thin film layer formed by deposition is used to configure lateral side wiring for connecting an upper circuit pattern and a lower circuit pattern of a substrate, thereby removing a bezel, and guaranteeing display quality because a division line or a bezel line is not seen even when a plurality of modules undergoes tiling to get a desired display size.

Abstract: A substrate side-deposition apparatus includes a substrate mounting drum rotatable within a chamber and allowing at least one substrate to be inserted and mounted in a direction from a circumferential surface toward a center; and at least one source target configured to deposit wiring based on sputtering to a lateral side portion of the substrate exposed protruding from the circumferential surface of the substrate mounting drum.

Abstract: Disclosed is a deposition apparatus for a substrate, in particular, a deposition apparatus for both lateral portions of a substrate, in which at least one substrate is inserted in and mounted to a revolvably disposed substrate mounting drum in a direction from an outside circumferential surface toward an inside circumferential surface, one lateral portion of the substrate exposed protruding from an inside circumferential surface is subjected to deposition based on an inside source target, and the other lateral portion of the substrate exposed protruding from an outside circumferential surface is subjected to deposition based on an outside source target, thereby depositing wiring to both lateral portions of the substrate at once, and achieving a three-dimensional (3D) deposition improved in uniformity and quality.

Abstract: The disclosure relates to an LED display module, and more particularly to an LED display module, in which a conductive metal thin film layer formed by deposition is used to configure lateral side wiring for connecting an upper circuit pattern and a lower circuit pattern of a substrate, thereby removing a bezel, and guaranteeing display quality because a division line or a bezel line is not seen even when a plurality of modules undergoes tiling to get a desired display size.

Abstract: An apparatus for depositing a metal film on a surface of a three-dimensional object, includes a mounting drum rotatably disposed inside a chamber and having a circumferential surface onto which a plurality of three-dimensional objects is settled and mounted making each surface thereof to be subjected to deposition be exposed to an outside; and at least one source target depositing a metal film onto the surface of the three-dimensional object mounted to the mounting drum by sputtering.

Abstract: A substrate side-deposition apparatus includes a substrate mounting drum rotatable within a chamber and allowing at least one substrate to be inserted and mounted in a direction from a circumferential surface toward a center; and at least one source target configured to deposit wiring based on sputtering to a lateral side portion of the substrate exposed protruding from the circumferential surface of the substrate mounting drum.

Abstract: Disclosed is a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.

Abstract: Disclosed is a solder particle including a plastic core; a copper-free metal layer which is formed on an external surface of the plastic core; and a solder layer which is formed on the copper-free metal layer and contains not less than 85 wt % tin. Thus, it is possible to provide a solder particle with a copper-free metal layer, which is excellent in strength and conductivity and prevents or minimizes generation of a void during a reflow process or the like.

Abstract: Disclosed is a solder particle including a plastic core; a copper-free metal layer which is formed on an external surface of the plastic core; and a solder layer which is formed on the copper-free metal layer and contains not less than 85 wt % tin. Thus, it is possible to provide a solder particle with a copper-free metal layer, which is excellent in strength and conductivity and prevents or minimizes generation of a void during a reflow process or the like.