Patents Assigned to Texas Instruments Incorprated
  • Die testing using top surface test pads
    Publication number: 20060205099
    Abstract: Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.
    Type: Application
    Filed: April 12, 2006
    Publication date: September 14, 2006
    Applicant: Texas Instruments Incorprated
    Inventors: Lee Whetsel, Richard Antley