Abstract: An LED lamp includes a lamp housing including an aluminum alloy substantially free of silicone. An electrical circuit trace is disposed on the lamp housing. An LED is attached directly to the lamp housing and electrically connected to the electrical circuit trace. LED driver circuitry is electrically connected to the electrical circuit trace. A housing contains the LED driver circuitry. A threaded incandescent light-type electrical plug may be configured for reception into a standard incandescent light-type socket. The LED driver circuitry is electrically disposed between the electrical plug and the LED. The lamp housing may include a generally frusto-conical shape. A solder mask may be affixed over at least a portion of the electrical circuit trace. The lamp housing may be press formed. The lamp housing is in direct thermal conductive relation to the LED such that heat energy is dissipated from the LED directly to the lamp housing.

Abstract: An outdoor LED lamp assembly includes a light transmissive cover disposed over at least one LED chip of the lamp assembly. A heating element is provided for providing heat to the cover. A sensor may be used to detect cover conditions, such as the accumulation of condensation, ice or snow on the cover, so as to provide electricity to the heating element and heat the cover in order to remove the condensation, ice or snow on the cover.

Abstract: A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. The anodized surface is chemically etched and circuit traces that include an LED landing are formed on the etched anodized surface. LEDs are electrically and mechanically attached to the LED landing by way of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and LED landing to the base and heat sink through a metal-to-metal contact pathway.

Abstract: An LED lamp includes a lamp housing including an aluminum alloy substantially free of silicone. An electrical circuit trace is disposed on the lamp housing. An LED is attached directly to the lamp housing and electrically connected to the electrical circuit trace. LED driver circuitry is electrically connected to the electrical circuit trace. A housing contains the LED driver circuitry. A threaded incandescent light-type electrical plug may be configured for reception into a standard incandescent light-type socket. The LED driver circuitry is electrically disposed between the electrical plug and the LED. The lamp housing may include a generally frusto-conical shape. A solder mask may be affixed over at least a portion of the electrical circuit trace. The lamp housing may be press formed. The lamp housing is in direct thermal conductive relation to the LED such that heat energy is dissipated from the LED directly to the lamp housing.

Abstract: A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. The anodized surface is chemically etched and circuit traces that include an LED landing are formed on the etched anodized surface. LEDs are electrically and mechanically attached to the LED landing by means of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and LED landing to the base and heat sink through a metal-to-metal contact pathway.

Abstract: A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by a conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway.