Patents Assigned to The Bergquist Company
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Publication number: 20150140411Abstract: A battery system includes a polyurea coating applied to a metal casing of a battery cell, wherein the polyurea coating is formed from a reaction mixture of an isocyanate component with ceramic particles, and an amine component with ceramic particles. The ceramic particle-filled polyurea coating exhibits a suitable thermal conductivity to substantially reduce thermal impedance to heat transfer from and to the battery cell, as well as sufficient electrical insulation.Type: ApplicationFiled: November 20, 2013Publication date: May 21, 2015Applicant: The Bergquist CompanyInventors: Wei Li, Sanjay Misra
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Publication number: 20140182924Abstract: An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.Type: ApplicationFiled: January 3, 2013Publication date: July 3, 2014Applicant: THE BERGQUIST COMPANYInventor: The Bergquist Company
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Publication number: 20130221014Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.Type: ApplicationFiled: April 2, 2013Publication date: August 29, 2013Applicant: The Bergquist CompanyInventor: The Bergquist Company
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Patent number: 8430264Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.Type: GrantFiled: April 12, 2011Date of Patent: April 30, 2013Assignee: The Bergquist CompanyInventors: Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz
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Patent number: 8205766Abstract: A package for delivery of a tacky product includes a carrier tape with a plurality of cavities separately disposed along a length thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier tape may be configured for use in tape and reel packaging systems.Type: GrantFiled: May 20, 2009Date of Patent: June 26, 2012Assignee: The Bergquist CompanyInventors: Radesh Jewram, William E. McIntosh
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Patent number: 8110919Abstract: A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: GrantFiled: August 18, 2010Date of Patent: February 7, 2012Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Patent number: 8076773Abstract: A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.Type: GrantFiled: December 26, 2007Date of Patent: December 13, 2011Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Patent number: 7760507Abstract: An interconnect structure for operable placement between a first body and a second body, wherein the interconnect structure includes a first surface for operable juxtaposition with the first body, a second surface for operable juxtaposition with the second body, and a thickness dimension defined between the first and second surfaces. The interconnect structure includes a first thermally conductive material and a second electrically conductive material, wherein the second electrically conductive material is formed in one or more distinct structures, with the structures forming at least one substantially continuous pathway of the second material through the thickness dimension. The interconnect structure exhibits a compressive modulus along a thickness axis of less than about 100 psi.Type: GrantFiled: December 26, 2007Date of Patent: July 20, 2010Assignee: The Bergquist CompanyInventors: Radesh Jewram, Sanjay Misra
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Patent number: 6984685Abstract: A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.Type: GrantFiled: October 24, 2002Date of Patent: January 10, 2006Assignee: The Bergquist CompanyInventors: Sanjay Misra, Radesh Jewram, G M Fazley Elahee
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Patent number: 6898084Abstract: An apparatus for operably conveying heat away from a heat source includes a thermally conductive substrate having a thickness defining a planar boundary thereof, and an insert portion disposed in the substrate and being positioned so as not to extend beyond the planar boundary. The insert portion is a material having a thermal conductivity value of at least 1.5 times that of the substrate material along at least two axial directions, with one of such axial directions extending substantially perpendicularly to first and second opposed sides of the substrate.Type: GrantFiled: July 17, 2003Date of Patent: May 24, 2005Assignee: The Bergquist CompanyInventor: Sanjay Misra
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Patent number: 6797758Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.Type: GrantFiled: September 5, 2001Date of Patent: September 28, 2004Assignee: The Bergquist CompanyInventors: Sanjay Misra, G M Fazley Elahee
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Patent number: 6657297Abstract: A flexible plastic thermally conductive multilayer semiconductor mounting pad having a highly thermally conductive bulk layer with thermally conductive surface skin layers bonded integrally to opposed major surfaces thereof. The bulk layer and the surface skin layers are each filled with a finely divided thermally conductive particulate, with the skin layers being harder than the bulk layer and being blended with an amount of filler which is less than that present in the bulk layer.Type: GrantFiled: August 15, 2002Date of Patent: December 2, 2003Assignee: The Bergquist CompanyInventors: Radesh Jewram, Kasyap Venkata Seethamraju, Kevin L. Hanson
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Patent number: 6649325Abstract: Methods and formulations for use in preparing thermally conductive dielectric mounts for heat generating semi-conductor devices and associated circuitry. The formulations include a thermoplastic resin selected from the group consisting of polysulfone, poly-ethersulfone, poly-phenylsulfone, and poly-etherimides, with these resins being applied as a dispersion onto the surfaces of opposed metallic members. The dispersion is dried and thereafter treated under heat and pressure at temperatures greater than the glass transition temperature under unit pressures of between 100 psi and 800 psi and for periods in excess of about 30 minutes. The polymer resin may be filled with solid particulate such as alumina and/or boron nitride.Type: GrantFiled: May 25, 2001Date of Patent: November 18, 2003Assignee: The Bergquist CompanyInventors: Benjamin P. Gundale, Sanjay Misra
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Patent number: 6650215Abstract: A method of enhancing the heat dissipating properties of a rigid substrate plate through creation of an array of erect spaced-apart parallelly disposed metallic fins projecting from the heat dissipating surface of the plate. The fins are created by superimposing a sheet of metallic foil upon a metallic plate, with the foil being bonded to the plate by welding utilizing ultrasonic energy. The welds are formed as spaced-apart parallel bands, with the foil being slit adjacent one edge of the band, with the foil thereafter being folded outwardly to form the heat dissipating metallic foil fins. The folding operation is undertaken following the steps of populating the substrate, thereby eliminating the requirement for unusual steps or precautions to protect what otherwise would be outwardly extending metallic fins.Type: GrantFiled: June 17, 2002Date of Patent: November 18, 2003Assignee: The Bergquist CompanyInventor: Benjamin P. Gundale
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Publication number: 20030187116Abstract: A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum.Type: ApplicationFiled: October 24, 2002Publication date: October 2, 2003Applicant: The Bergquist CompanyInventors: Sanjay Misra, Radesh Jewram, G M Fazley Elahee
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Patent number: 6624224Abstract: A thermally conductive mechanically compliant pad of high stability including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a flowable plastic resin consisting of a blend of silicone oil and octyl-ethoxysilane to form the mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metallic coated particulate, balance flowable plastic resin blend.Type: GrantFiled: October 17, 2000Date of Patent: September 23, 2003Assignee: The Bergquist CompanyInventor: Sanjay Misra
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Patent number: 6611256Abstract: A touch screen assembly for contact input systems, with the touch screen including a base substrate with an electrically resistive coating thereon. An array of reticulated spaced raised projections are formed on the inner surface, with the raised projections consisting of a developed/cured photoresist. In its formation, the photoresist is applied as an adherent layer with a release-film backing, with the layer being applied onto a heated substrate. Thereafter, a laminate is formed by passing the photoresist layer beneath a heated pneumatically actuated nip roll to cause the photoresist layer to flow, thereby forming a layer of uniform thickness. Thereafter, the laminate is masked, exposed to incident radiation, and developed so as to provide a reticulated pattern of adherent raised projections. A flexible plastic film having a resistive coating thereon is thereafter mounted on the substrate in superimposed relationship to the raised projections.Type: GrantFiled: October 4, 2001Date of Patent: August 26, 2003Assignee: The Bergquist CompanyInventor: Mary L. Randall
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Patent number: 6559835Abstract: An improved electrode arrangement for touch screen panels wherein the conductive segments forming the edge arrays and the elongated buses which deliver input signals to the arrays are in stacked superimposed relationship, one to the other. At the respective cross-over points between the buses and the conductive segments, the respective axes are angularly disposed, one to the other, so as to eliminate the creation of an impedance which may adversely affect the accuracy of the output of the touch screen. Each cross-over point is located along a solid portion of the conductive segments comprising the array.Type: GrantFiled: February 19, 2001Date of Patent: May 6, 2003Assignee: The Bergquist CompanyInventor: Mary L. Randall
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Publication number: 20030027910Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.Type: ApplicationFiled: September 5, 2001Publication date: February 6, 2003Applicant: The Bergquist CompanyInventors: Sanjay Misra, Gm Fazley Elahee
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Patent number: RE39992Abstract: A thermally conductive mechanically compliant pad including a quantity of gallium and/or indium alloy liquid at temperatures below about 120° C. and a boron nitride particulate solid blended into the liquid metal alloy to form a paste. The paste is then combined with a quantity of a matrix forming flowable plastic resin such as microwax, silicone wax, or other silicone polymer to form the thermally conductive mechanically compliant pad, the compliant pad comprising from between about 10% and 90% of metal alloy coated particulate, balance flowable plastic resin.Type: GrantFiled: May 4, 2005Date of Patent: January 1, 2008Assignee: The Bergquist CompanyInventors: Sanjay Misra, GM Fazley Elahee