Patents Assigned to THE CO., LTD.
  • Patent number: 10873549
    Abstract: A message processing method and an electronic device for supporting the same are provided. The electronic device includes a communication interface configured to receive a message including a plurality of pages, and a control module configured to process the received message, wherein, if undefined data exists among data contained in a specific page of the plurality of pages, the control module combines at least a part of data contained in a next page that is sequential to the specific page with the undefined data.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: December 22, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyu Hyun Kim, Min O Kim, In Soo Kim, Jun Ho You, Sang Min Bae
  • Patent number: 10869494
    Abstract: Providing a D-psicose-containing sweetener with the modification of the taste of D-psicose, comprising D-psicose, a sugar alcohol and/or a high intensity sweetener, preferably containing D-psicose as the main component, particularly a low-calorie sweetener and/or a sweetener giving refreshing feel in the oral cavity, as well as foods and drinks obtained by using the D-psicose-containing sweetener with the modification of the taste of D-psicose, and other products given with sweetness. The sugar alcohol is one or more sugar alcohols selected from the group consisting of sorbitol, mannitol, lactitol, maltitol, xylitol and erythritol, while the high intensity sweetener is one or more high intensity sweeteners as selected from aspartame, acesulfame K, sodium cyclamate, sodium saccharin, Sucralose (under trade name), stevia sweetener, dulcin, taumatin, neotame and monellin.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: December 22, 2020
    Assignee: MATSUTANI CHEMICAL INDUSTRY CO., LTD.
    Inventors: Hideki Fujihara, Kazuhiro Okuma, Tetsuo Iida, Ken Izumori, Masaaki Tokuda, Kazuhiro Fukada
  • Patent number: 10873413
    Abstract: Embodiments are provided for a scheme of link adaptation (LA) in uplink grant-less random access (RA) communications. The scheme includes changing a modulation and coding (MCS) of a user, instead of using a fixed MCS over time, as the user link, channel, or non-link conditions vary during the RA communications. In an embodiment, a transmission point (TP) receives from a UE a packet encoded using a MCS, and detects a condition associated with uplink measurements or other non-link based condition of the UE. The TP then initiates an upgrade or a downgrade of the MCS in accordance with the condition, and signals the UE indicating a second MCS as a result. The UE thus sends a second packet encoded using the second MCS. In another embodiment, the UE initiates the MCS change in accordance to detecting a link or non-link based condition, such as change of mobility.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 22, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Liqing Zhang, Kelvin Kar Kin Au, Jianglei Ma
  • Patent number: 10870237
    Abstract: A powder supply device (100) for use with powder spreaders, comprising: a fixation base (2), a powder storage unit (3), a powder supply unit (4) and a driving unit (5), wherein the powder supply unit (4) is provided with at least one stirring bar (41) and a powder spreading roller (42); using a design of a stirring bar and the powder spreading roller, powder may be stirred and extruded such that the powder becomes finer, more uniform, and does not cake during powder spreading.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: December 22, 2020
    Assignee: TONGTAI MACHINE & TOOL CO., LTD.
    Inventors: Huaien Kao, Hsinpao Chen, Juihsiung Yen
  • Patent number: 10872777
    Abstract: The present disclosure relates to integrated circuit device manufacturing processes. A self-aligned double patterning method is provided. In the method, a lithography process for line cut that determines the locations of line termini is performed after forming a spacer layer alongside the mandrel and prior to stripping the mandrel. The lithographic mask for the line cut is aligned to the mandrel and the spacer layer using a mark made of the mandrel material and the spacer material. Compared to the previous approach where the line cut process is performed after the mandrel removal, in the disclosed approach, the line termini mask is made of the mandrel material and the spacer material, and is more distinguishable compared to a mark made of just the spacer material. Thereby, the methods provide robust photo alignment signal for the line cut photolithography and precise positioning of the line termini mask.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: December 22, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Yu Pan, Kuo-Chyuan Tzeng, Lee-Chuan Tseng, Ying-Hua Chen
  • Patent number: 10872853
    Abstract: A module with high reliability is provided by inhibiting occurrences of air bubbles caused with rise in flow resistance of resin when a sealing resin layer is formed using a die. A module includes a wiring board, components mounted over an upper face of the wiring board, and a sealing resin layer laminated over the upper face. On the upper face, the sealing resin layer includes a high-level region with a long distance from the upper face of the wiring board, a low-level region with a short distance from the upper face, and a level difference region. In a portion included in the wiring board and corresponding to the low-level region and the level difference region, a thin portion is formed so as to be thinner than the remaining portion and overlaps the low-level region at least partially in a plan view.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: December 22, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Issei Yamamoto
  • Patent number: 10872896
    Abstract: A Static Random Access Memory (SRAM) cell includes a write port including a first inverter including a first pull-up transistor and a first pull-down transistor, and a second inverter including a second pull-up transistor and a second pull-down transistor and cross-coupled with the first inverter; and a read port including a read pass-gate transistor and a read pull-down transistor serially connected to each. A first doped concentration of impurities doped in channel regions of the second pull-down transistor and the read pull-down transistor is greater than a second doped concentration of the impurities doped in a channel region of the first pull-down transistor, or the impurities are doped in the channel regions of the second pull-down transistor and the read pull-down transistor and are not doped in the channel region of the first pull-down transistor.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shau-Wei Lu, Hao Chang, Kun-Hsi Li, Kuo-Hung Lo, Kang-Yu Hsu, Yao-Chung Hu
  • Patent number: 10871741
    Abstract: A cleaning device that cleans a surface of an image holding unit capable of holding an image formed using an image forming material includes: a cleaning tool that is movable along an intersecting direction intersecting with a moving direction of the image holding unit and cleans the surface of the image holding unit when placed in a contact position where the cleaning tool is in contact with the surface of the image holding unit; and a guiding unit that guides the cleaning tool so that the cleaning tool moves from a non-contact position where the cleaning tool is not in contact with the image holding unit to the contact position for cleaning the surface of the image holding unit, wherein when the image holding unit is moved, the cleaning tool placed in the contact position cleans the surface of the image holding unit.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 22, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Keiichiro Sato
  • Patent number: 10871325
    Abstract: An embodiment of the present invention discloses a vacuum drying apparatus, including a sealing chamber, a gas pressure adjusting device, and a support platform in the sealed chamber; wherein the air pressure adjusting device includes a main air pipe and a branch air pipe connected to the main air pipe, and the main air pipe is symmetrically disposed at a portion and a lower portion of the side surface of the sealed chamber. An embodiment of the present invention provides a vacuum drying apparatus employing the main air pipe up and down symmetrically disposed, which shortens the distance of air supply of the branch air pipe, reduces the pressure drop of the airflow, and stabilizes upper and lower air pressure, thereby stabilizing the product characteristics.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: December 22, 2020
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Yuan Guan
  • Patent number: 10871602
    Abstract: A backlight module is disclosed. The backlight module includes a light emitting component, a first light guide plate and a second light guide plate. The first light guide plate is disposed above the light emitting component and includes a first hole located correspondingly to the light emitting component. The second light guide plate is disposed between the light emitting component and the first light guide plate and includes a second hole. The second hole is located corresponding to the light emitting component and communicates with the first hole. The diameter of the second hole is greater than the diameter of the first hole.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: December 22, 2020
    Assignee: CHICONY POWER TECHNOLOGY CO., LTD.
    Inventors: Hsuan-Wei Ho, Yueh-Heng Lee
  • Patent number: 10872873
    Abstract: A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh
  • Patent number: 10873980
    Abstract: The present disclosure relates to a connection control apparatus and method. The method includes: receiving a link configuration request message sent by a second terminal; sending a bearer configuration request message to a network-side device according to the link configuration request message; receiving a bearer configuration complete message that is sent by the network-side device according to the bearer configuration request message; establishing a mapping relationship between the service bearer and the second terminal; and sending a link configuration complete message to the second terminal after the mapping relationship is established, so that the second terminal performs data transmission with the network-side device over the service bearer by using the first terminal.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: December 22, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Bo Lin, Hong Wang, Yajuan Li
  • Patent number: 10872767
    Abstract: A laser annealing apparatus, a fabrication method of a polysilicon thin film, and a fabrication method of a thin film transistor are provided. The laser annealing apparatus includes: a laser generator, an optical system and an annealing chamber. The laser generator is configured to emit a laser beam, and the laser beam is guided to the annealing chamber via the optical system. The optical system includes a beam splitter, the beam splitter decomposes the laser beam into a first beam and a second beam, an energy density of the first beam is greater than an energy density of the second beam, and the first beam and the second beam are guided into the annealing chamber for laser annealing.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: December 22, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECETRONICS CO., LTD.
    Inventor: Jingshuai Wang
  • Patent number: D905652
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungho Lee, Eunah Kim, Jaewook Yoo, Jangho Kim
  • Patent number: D905670
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: December 22, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun Seo, Won-Kyu Sung
  • Patent number: D905676
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: December 22, 2020
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ji Hyun Kim
  • Patent number: D905686
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: December 22, 2020
    Assignee: Shanghai Xinxie Industrial Co., Ltd
    Inventor: Qinbing Zhang
  • Patent number: D905700
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: December 22, 2020
    Assignee: Hangzhou Yue Fu Si Supply Chain Management Co., Ltd
    Inventors: Zhiye Lu, Weiwei Li
  • Patent number: D905712
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: December 22, 2020
    Assignee: REVOTEK CO., LTD
    Inventors: Lin Li, Changjiang Liao, Wende Jing
  • Patent number: D905894
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: December 22, 2020
    Assignee: Xiamen Konshine Lighting Electron Co., Ltd.
    Inventor: Houlin Chen