Abstract: A system and methods of fitting golf clubs, and more particularly, the systems and methods related to wedge type golf clubs, having multiple sole configurations and/or bounce angles. More specifically, the present invention is directed to system and methods that enable a player to quantify the performance of the golf club's sole interaction with the ground and to determine the sole configuration and bounce angle that provides the most optimal shot performance.

Abstract: An integrated circuit package includes first and second dies bonded to each other. The first die includes first die pads over a first device, first bonding pads over the first die pads, a first conductive via disposed between and electrically connected to a first one of the first die pads and a first one of the first bonding pads, and a first thermal via disposed between a second one of the first die pads and a second one of the first bonding pads and electrically insulated from the second one of the first die pads or the second one of the first bonding pads. The second die includes second bonding pads. The first one of the first bonding pads is connected to a first one of the second bonding pads. The second one of the first bonding pads is connected to a second one of the second bonding pads.

Abstract: The present disclosure describes multi-fluid kits for three-dimensional printing, three-dimensional printing kits, and methods of making three-dimensional printed articles. In one example, a multi-fluid kit for three-dimensional printing can include a fusing agent and a second fluid agent. The fusing agent can include water and a radiation absorber. The radiation absorber can absorb radiation energy and convert the radiation energy to heat. The fusing agent or the second fluid agent can include a water-soluble or water-dispersible dihydrazide antioxidant.

Abstract: In one example in accordance with the present disclosure, a fluorescence detection system is described. The fluorescence detection system includes a microfluidic chamber to receive a sample containing a compound to be detected. An illumination system provides an excitation light to excite fluorophores in the microfluidic chamber. An outcoupler is disposed between the illumination system and the microfluidic chamber to diffuse the excitation light to fill the microfluidic chamber. The fluorescence detection system also includes a detection system to detect fluorescence generated by the excitation of the fluorophores in the microfluidic chamber.

Abstract: A pellicle for an EUV photo mask includes a base membrane layer, a core layer disposed over the base membrane layer and one or more metallic layers disposed over the core layer.

Abstract: Devices with metal structures formed with seams and methods of fabrication are provided. An exemplary method includes forming a metal plug having a top surface formed with a seam; depositing a film over the top surface of the metal plug and at least partially filling the seam; and etching the film from over the metal plug, wherein the film remains in the seam.

Abstract: A die bonding system includes a pick-and-placer, a carrier fixing platform and a transfer platform. The pick-and-placer includes a suction head for picking up a die and placing the die on a carrier. The carrier fixing platform is used to fix the carrier. The carrier has a bearing surface arranged to face downward or to be inclined at an angle relative to a horizontal plane. The transfer platform includes a driver, the pick-and-placer is arranged on the transfer platform, and the driver controls the pick-and-placer to move to a location under the carrier or tilt the angle relative to the horizontal plane, and the pick-and-placer bonds the die to the bearing surface of the carrier from a location under the carrier or at the angle of tilt.

Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device structure includes forming a first fin structure and a second fin structure over a substrate. The method includes forming a dummy gate structure over the first fin structure and the second fin structure, and removing a portion of the first fin structure and the second fin structure to form a first source/drain (S/D) recess and a second S/D recess. The method includes forming a first bottom layer in the first S/D recess and a second bottom layer in the second S/D recess, and forming a first dielectric liner layer over the first bottom layer. The method includes forming a first top layer over the first dielectric liner layer, and forming a first S/D structure over the first top layer and a second S/D structure over the second bottom layer.

Abstract: The present disclosure is directed to gate-all-around (GAA) transistor structures with a low level of leakage current and low power consumption. For example, the GAA transistor includes a semiconductor layer with a first source/drain (S/D) epitaxial structure and a second S/D epitaxial structure disposed thereon, where the first and second S/D epitaxial structures are spaced apart by semiconductor nano-sheet layers. The semiconductor structure further includes isolation structures interposed between the semiconductor layer and each of the first and second S/D epitaxial structures. The GAA transistor further includes a gate stack surrounding the semiconductor nano-sheet layers.

Abstract: A user equipment (UE) executes a wireless communication method for execution by a user equipment (UE). The UE receives physical uplink control channel (PUCCH)-related configuration information and a physical downlink shared channel (PDSCH). The UE determines a slot/sub-slot location n for transmitting uplink control information (UCI) on a PUCCH, where n is a natural number slot/sub-slot index. The UE determines to transmit the PUCCH on a determined cell/carrier at slot/sub-slot location n based on one or more conditions in the PUCCH-related configuration information, wherein the determined cell/carrier comprises a first type cell/carrier or at least one second type cell/carrier. The UE transmits the PUCCH on the determined cell/carrier at slot/sub-slot location n.

Abstract: A two-agent type composition consisting of first agent and second agent, wherein: first agent contains an elastomer, a first and second acrylic component, a second acrylic component, and a polymerization initiator; second agent contains condensate of amine and aldehyde, third acrylic component, and reducing agent; the first acrylic component is (meth)acrylate or (meth)acrylic acid, containing two or more hydroxyl groups bonded to a carbon atom in one molecule, or containing one or more functional groups of one or more kind of functional groups selected from group consisting of an amide group, a cyclic amide group, a sulfoxide group, a ketone group, an aldehyde group, a sulfo group, a sulfino group, a phosphonic group, a sulfobetaine group, a carbobetaine group, and a phosphobetaine group in one molecule; second acrylic component is a (meth)acrylate or (meth)acrylic acid other than first acrylic component; and the third acrylic component is (meth)acrylate or (meth)acrylic acid.

Abstract: A laminate article includes a dielectric substrate including a perfluorocopolymer matrix comprising a fluorinated perfluorocopolymer and a non fluorinated perfluorocopolymer; a quartz fabric embedded in the perfluorocopolymer matrix; and an additive material dispersed in the perfluorocopolymer matrix, in which the additive material is capable of absorbing ultraviolet light; and a conductive cladding disposed on a surface of the dielectric substrate.

Abstract: In a method of manufacturing a semiconductor device, a memory cell structure covered by a protective layer is formed in a memory cell area of a substrate. A mask pattern is formed. The mask pattern has an opening over a first circuit area, while the memory cell area and a second circuit area are covered by the mask pattern. The substrate in the first circuit area is recessed, while the memory cell area and the second circuit area are protected. A first field effect transistor (FET) having a first gate dielectric layer is formed in the first circuit area over the recessed substrate and a second FET having a second gate dielectric layer is formed in the second circuit area over the substrate as viewed in cross section.

Abstract: A battery case includes a floor panel of a vehicle, which forms a floor of a body of the vehicle and at the same time, forms an upper panel of a battery case, a side sill positioned at opposite sides of the floor panel, extending in a longitudinal direction of the vehicle, and extending downwardly from the floor panel in a height direction, and front and rear barriers extending downwardly from a front portion and a rear portion of the floor panel connected to the side sill to form a sidewall portion of the battery case together with the side sill by being connected to the side sill.

Abstract: A method for testing and repairing a memory device is provided. The memory device includes a memory array having data cells and reference cells arranged along cell rows and cell columns. The data cells are configured to store data, and the reference cells are configured to generate a reference current for reading the data stored in the data cells. The method includes: performing a row repair, to test the reference cells in each cell row, and to replace the cell row containing at least one defective reference cell by a redundant cell row comprising additional data cells and additional reference cells; and performing a local reference current trimming, to modify a ratio of an amount of the reference cells programmed with a low resistance state over an amount of the reference cells programmed with a high resistance state for at least one of the cell rows.

Abstract: A lighting device of a steering wheel and an assembling method of the lighting device improving an assembly process and mass productivity of the lighting device by simplifying an assembly structure thereof, includes a grip body forming a rim of the steering wheel and including a body groove portion formed in a shape in which the body groove portion is cut away along the rim, a bezel fitted to the body groove portion and assembled to the grip body so that the body groove portion is covered by the bezel, the bezel including a center portion provided with a light transmission hole, and includes a light emitting body assembled to the bezel to overlap the light transmission hole from between the body groove portion and the bezel, the light emitting body being configured to emit light through the light transmission hole.

Abstract: The present disclosure addresses the problem of providing a method for evaluating the state of skin by employing a simple measurement measure, for example a method for evaluating the degree of aging of skin, the elasticity of skin, the sagging of skin or the wrinkling of skin, and the present disclosure provides a skin state evaluation method in which the state of skin is evaluated by employing the state of downy hair on skin as a criterion for the determination. More specifically, the present disclosure relates to a method for evaluating the state of skin by employing, as an evaluation item, at least one of the density of downy hairs, the thickness of downy hair and the length of downy hair. Also provided are an apparatus and program both for performing the evaluation of the state of skin by employing the state of downy hair on skin as a criterion for the determination.

Abstract: A method for handling a semiconductor substrate includes: placing a semiconductor substrate over a semiconductor apparatus, where a central portion of the semiconductor substrate overlies a carrying surface of a chuck table of the semiconductor apparatus, an edge portion of the semiconductor substrate overlies a top surface of a first flexible member of the semiconductor apparatus, the first flexible member is disposed within a recess of the chuck table and extends along a perimeter of the carrying surface, and a gap forms among the semiconductor substrate, the carrying surface of the chuck table, and the top surface of the first flexible member; and introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member.

Abstract: Provided is a rubber composition capable of improving the scorch time of the unvulcanized product, and the hardness, tensile strength, and freeze resistance of the vulcanizate in a well-balanced manner. According to the present invention, there is provided a rubber composition including a chloroprene-based rubber having a content of an unsaturated nitrile monomer unit of less than 25% by mass and an epoxy compound having a weight average molecular weight more than 100 and less than 900, wherein the rubber composition contains 0.1 to 25 parts by mass of the epoxy compound with respect to 100 parts by mass of the chloroprene-based rubber.

Abstract: A cathode for a high voltage lithium-ion secondary battery is described, including: an electrode layer having an electrode composition containing cathode active particles, fluoropolymer binder and conductive carbon. The cathode active particles are high voltage lithium transition metal oxides, the fluoropolymer binder is a fibrillated tetrafluoroethylene polymer having high melt creep viscosity, and the conductive carbon is carbon fibers having a specific surface area of about 50 m2/g or less. The carbon fibers and the fluoropolymer binder form a conducting structural web electronically connecting the cathode active particles, enabling electronic conductivity through the electrode layer. The electrode layer is adhered to a current collector comprising aluminum having surface roughness and substantially no carbon surface coating other than the conductive carbon of the electrode layer.