Abstract: Provided is an assembly jig set of semiconductor module having a plurality of semiconductor chips, the assembly jig set comprising: a first outer frame jig; and a plurality of inner piece jigs positioned by the first outer frame jig and each having a sectioned shape corresponding to the first outer frame jig, wherein one of the inner piece jigs has a plurality of opening portions for positioning the semiconductor chips. A manufacturing method of a semiconductor module using an assembly jig set is provided.

Abstract: An optical device includes a metal reflective layer substantially made of a metal material, a first light transmissive layer disposed on the metal reflective layer, an optical multilayer reflective film disposed on the first light transmissive layer and including a plurality of sublayers stacked on each other and having different refractive indexes, and a wavelength converting layer disposed on the optical multilayer reflective film and containing a fluorescent material capable of absorbing incident excitation light and generating fluorescent light having a lower energy. The wavelength converting layer is capable of generating mixed light containing the excitation light and the fluorescent light in response to irradiation with the excitation light.

Abstract: Provided is power supply device configured for safe discharge to the outside of the power supply device even when gas at high temperature and under high pressure is discharged from a secondary battery cell, power supply device including: a plurality of secondary battery cells each having gas discharge valve for discharging internal gas; and cover part disposed on one surface of battery stack with the plurality of secondary battery cells stacked while covering gas discharge valve of each of the plurality of secondary battery cells. Cover part is provided inside with a gas guide path partitioned to discharge gas discharged from gas discharge valve to the outside of cover part, and the gas guide path includes one or more horizontal gas flow bending portions that bend at least a flow direction of some of the gas in plan view of cover part.

Abstract: Provided is a semiconductor device, comprising: a semiconductor substrate having an upper surface, a lower surface, and a center position equidistant from the upper surface and the lower surface in a depth direction of the semiconductor substrate. An N-type region with an N-type conductivity is provided in the semiconductor substrate such that the N-type region includes the center position of the semiconductor substrate. The N-type region includes an acceptor with a concentration that is a lower concentration than a carrier concentration, and is 0.001 times or more of a carrier concentration at the center position of the semiconductor substrate.

Abstract: A reinforcing sleeve for collectively reinforcing spliced portions of a plurality of optical fiber core wires disposed side by side includes a heat-shrinkable tube, a heat-meltable member, a tension member, and so on. The tension member and the heat-meltable member are inserted into the heat-shrinkable member. A thick portion is provided at a substantially center portion of a width direction of the heat-meltable member. Thus, on a cross section perpendicular to a longitudinal direction of the heat-meltable member, an amount of the heat-meltable member at proximity of the center portion of the width direction of the heat-meltable member is greater than an amount of the heat-meltable member at proximity of the end portions of the width direction of the heat-meltable member. This forms a flow of the heat-meltable member from the center portion toward the end portions in the width direction at the time of melting the heat-meltable member.

Abstract: A fluid ejection device that includes a housing, a fluid reservoir disposed in the housing and a fluid ejection head. A revolving maintenance station that includes an ejection head wiper and an ejection head capping device is movably attached to the housing and is configured for rotation to selectively position the ejection head wiper or the ejection head capping device adjacent to the fluid ejection head.

Abstract: A switchboard monitoring system, according to one embodiment of the present specification, comprises: a thermal imaging apparatus for acquiring thermal imaging information of a device disposed in a switchboard panel; and a control apparatus for receiving the thermal imaging information from the thermal imaging apparatus, generating temperature information of the device on the basis of the received thermal imaging information, and detecting the temperature state of the device on the basis of the generated temperature information.

Abstract: A digital dispense system and methods for preparing samples for analysis. The digital dispense system includes a fluid droplet ejection system housed in a housing unit. The fluid droplet ejection system contains a fluid droplet ejection head and fluid cartridge containing one or more fluids to be dispensed. A cartridge translation mechanism is provided for moving the fluid droplet ejection head and fluid cartridge back and forth over a sample holder in an x direction. A sample tray translation mechanism moves a sample tray back and forth beneath the fluid droplet ejection head and fluid cartridge in a y direction orthogonal to the x direction.

Abstract: The present invention discloses an automatic tripping and anti-falling lightning arrester which includes an insulator main body, a lightning arrester body and an anti-falling member, wherein the insulator main body with a sealed cylinder structure, and a magnet adsorption surface inside the insulator main body; the lightning arrester body has a disconnection unit and a lightning arresting core respectively arranged from top to bottom, and the lightning arrester body is located inside the insulator main body, the disconnection unit includes a magnetic tripping module wherein a magnet is provided, and wherein the disconnection unit is adsorbed onto the magnet adsorption surface, wherein aging of the lightning arresting core results in a thermal effect inside the magnetic tripping module, which makes the disconnection unit disconnected from the magnet adsorption surface, and wherein the anti-falling member is provided on the insulator main body.

Abstract: A power conversion device includes a controller configured to alternately turn on a second upper arm and a second lower arm of a first bridge circuit such that on-times thereof do not overlap each other to increase power stored in a resonance capacitor of the first bridge circuit in a state in which a first leg of the first bridge circuit is turned off when transmitting power from a second bridge circuit to the first bridge circuit and performing step-up operation.

Abstract: An optical power transmission apparatus includes: a light emitting unit including a first optical gain generating means and a first light reflecting means; an optical fiber; a second light reflecting means; and a light receiving means. Further, the second light reflecting means is arranged nearer to the light receiving means than the optical fiber is, a first laser resonator is formed, between the first light reflecting means and the second light reflecting means, by optical connection between the first optical gain generating means and the optical fiber, and first laser light generated by the first laser resonator is configured to be incident on the light receiving means.

Abstract: A movable magnet is configured by alternately magnetizing an even number of magnetic poles at an outer periphery of a shaft part; a number of core magnetic poles as magnetic poles of a core body and a number of magnetic poles of the movable magnet are equal to each other; the core magnetic poles are disposed to face the movable magnet with an air gap therebetween on an outer peripheral side of the movable magnet in a direction orthogonal to the shaft part; a drive unit is provided with a magnet position holding part provided to face the movable magnet and magnetically attracts the movable magnet to a reference position; the core body is formed to surround an even number of the core magnetic poles; and a coil body is disposed at the core body adjacent to each of the even number of the core magnetic poles.

Abstract: This magnetic disk device is a 3.5-inch magnetic disk device equipped with magnetic disks formed from an aluminum alloy substrate. The magnetic disks arranged in a stacked manner have a thickness Td of 0.3 mm to 0.6 mm, the number N of magnetic disks involved is 10 to 16, and spacers disposed between the magnetic disks have an outside diameter 2 Rso of 35 mm to 65 mm. The outside diameter 2 Rso (mm) of the spacers satisfies 2 Rso??60 Td+70 and 2 Rso??0.5 N2?+16.5 N?73.

Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.

Abstract: A semiconductor device includes a semiconductor module having a wiring board, semiconductor assemblies that include a multilayer substrate on which semiconductor elements are mounted, and a sealing part; a cooler; and a heat conduction sheet which is placed between the semiconductor module and the mounting surface of the cooler and which is in contact with the bottom surfaces of the multilayer substrates. The heat conduction sheet has recesses corresponding to at least parts of the outer edges of second electrically conductive plates provided on the bottoms of the multilayer substrates.

Abstract: A detection circuit including a temperature voltage generator circuit and an output circuit. The temperature voltage generator circuit generates a detection voltage corresponding to a temperature of the detection circuit based on a predetermined constant current, when a pulse signal received by the detection circuit is at a first level, and stop generating the detection voltage when the pulse signal is at a second level. The output circuit outputs a detection signal indicating whether the temperature is higher than a predetermined temperature based on the detection voltage, during a period of time between a first time that is a predetermined time period after the pulse signal reaches the first level and a second time at which the pulse signal switches from the first level to the second level, the pulse signal remaining in the first level in the period of time.

Abstract: The present disclosure provides a cleaning device. The cleaning device may include a machine body, a cleaning liquid tank, and a floor brush, wherein the floor brush may be connected to an end of the machine body, the cleaning liquid tank may be arranged above the floor brush, and the cleaning liquid tank may be configured to provide cleaning liquid for the floor brush or floor. When a user uses the cleaning device for cleaning work, the user may hold the machine body to control a moving direction of the floor brush. In the cleaning device, by setting a cleaning liquid tank on the floor brush, a volume and weight of the machine body can be reduced, which reduces an overall volume and weight of the cleaning device, thereby reducing a load and weight when the user operates the machine body and improving experience of the user during cleaning work.

Abstract: This invention is capable of detailed control in accordance with the mode of using a lighting apparatus and the like.