Abstract: The present disclosure provides a method of dual-phase hot metal extrusion comprising (i) providing a load carrier made of a first metal material, wherein the load carrier comprises one or more load chambers containing a second metal material, wherein the melting point of the second metal material is lower than the melting point of the first metal material, (ii) heating the load carrier to a temperature above the melting point of the second metal material and suitable for extrusion of the load carrier, and (iii) extruding the load carrier to form an extruded product. The present disclosure also provides apparatuses for accomplishing the dual-phase hot extrusion of metals and products resulting from such processes.
Type:
Grant
Filed:
March 14, 2013
Date of Patent:
December 19, 2017
Assignee:
THE ELECTRIC MATERIALS COMPANY
Inventors:
Philip O. Funk, Douglas S. Winner, Seth Lafountain Wyse, Benjamin Anthony Laemmerhirt
Abstract: The present disclosure provides a method of dual-phase hot metal extrusion comprising (i) providing a load carrier made of a first metal material, wherein the load carrier comprises one or more load chambers containing a second metal material, wherein the melting point of the second metal material is lower than the melting point of the first metal material, (ii) heating the load carrier to a temperature above the melting point of the second metal material and suitable for extrusion of the load carrier, and (iii) extruding the load carrier to form an extruded product. The present disclosure also provides apparatuses for accomplishing the dual-phase hot extrusion of metals and products resulting from such processes.
Type:
Grant
Filed:
August 19, 2015
Date of Patent:
November 8, 2016
Assignee:
THE ELECTRIC MATERIALS COMPANY
Inventors:
Philip O. Funk, Douglas S. Winner, Seth Lafountain Wyse, Benjamin Anthony Laemmerhirt
Abstract: The present disclosure provides a method of dual-phase hot metal extrusion comprising (i) providing a load carrier made of a first metal material, wherein the load carrier comprises one or more load chambers containing a second metal material, wherein the melting point of the second metal material is lower than the melting point of the first metal material, (ii) heating the load carrier to a temperature above the melting point of the second metal material and suitable for extrusion of the load carrier, and (iii) extruding the load carrier to form an extruded product. The present disclosure also provides apparatuses for accomplishing the dual-phase hot extrusion of metals and products resulting from such processes.
Type:
Grant
Filed:
March 14, 2013
Date of Patent:
September 29, 2015
Assignee:
THE ELECTRIC MATERIALS COMPANY
Inventors:
Philip O. Funk, Douglas S. Winner, Seth Lafountain Wyse, Benjamin Anthony Laemmerhirt