Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.
Type:
Grant
Filed:
December 3, 2018
Date of Patent:
January 16, 2024
Assignees:
DOWA HOLDINGS CO., LTD., THE GOODSYSTEM CORPORATION
Inventors:
Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho
Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.
Type:
Application
Filed:
December 3, 2018
Publication date:
June 10, 2021
Applicants:
Dowa Holdings Co., Ltd., The Goodsystem Corporation
Inventors:
Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho