Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.

Abstract: A data storage disc carrier (1) for carrying discs (10). The carrier includes an axial clamping mechanism which incorporates a three legged resilient clamping member (7) that can flees between release and clamping positions to allow easy loading a gripping of discs (10). The clamping member is articulatingly mounted on a tail (4) that is gripped to provide clamping.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: A reflective metrological scale has a metal tape substrate and a scale pattern of elongated side-by-side marks surrounded by reflective surface areas of the substrate. Each mark has a furrowed cross section and may have a depth in the range of 0.5 to 2 microns. The central region of each mark may be rippled and darkened to provide an enhanced optical reflection ratio with respect to surrounding surface areas. A manufacturing method includes the repeated steps of (1) creating a scale mark by irradiating the substrate surface at a mark location with overlapped pulses from a laser, each pulse having an energy density of less than about 1 joule per cm2, and (2) changing the relative position of the laser and the substrate by a displacement amount defining a next mark location on the substrate at which a next mark of the scale is to be created.

Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.

Abstract: A fibre laser system is disclosed comprising an optical fibre, a part of which is doped with a rare earth to form an optical gain medium; at least one laser diode; means for applying pump radiation from the laser diode to the optical gain medium and for generating a laser beam and delivery fibre means for delivering a laser beam to a workpiece, wherein the fibre laser is provided with at least one means for protecting one or more components from damage caused by errant radiation. Several different means of protection are disclosed.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: A position transducer system is disclosed for a limited rotation motor that includes an illumination source that directs illumination toward an illumination reflector that rotates with a rotor of the limited rotation motor, and a plurality of detector areas adjacent the illumination source for receiving modulated reflected illumination from the illumination reflector.

Abstract: A laser processing system is disclosed for providing a relatively small velocity of a laser beam at target location while at least one scanner scans at a relatively larger velocity. The system includes a laser source, a first scanning unit, a beam expander, a second scanning unit and focusing optics. The laser source is for providing a pulsed laser output having at least one beam with a beam dimension. The first scanning unit is for scanning the laser output in a first direction along a first axis at the target location. The beam expander is for receiving the laser output and for modifying a beam diameter of the laser output and providing a modified laser output. The second scanning unit is for scanning the modified laser output from the beam expander in a second direction along the first axis at the target location.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: A grain for the storage of grain millions of bushels of grain comprises a floor, a peripheral wall and a flexible covering. The grain bin includes an unloading system which enables the grain to be unloaded from the grain bin without the need to remove the covering and which substantially reduces the dust typically produced during unloading of currently used temporary grain bins.

Abstract: A combined plenum divider/hopper is provided for a grain drying tower. The divider/hopper is positioned in the drying tower proximate the heater for the drying tower and is operable to adjust the ratio of the length of the heating portion of the plenum to the length of the cooling portion of the plenum.

Abstract: A control assembly for use in a feed delivery assembly comprises a housing having an inlet, an outlet, and a chamber between said inlet and outlet. The chamber is opened in a plane parallel, but radially offset from, an axis of the inlet and outlet. A tube member is removably receivable in the chamber. The removable tube member includes a tube having a length sufficient to span a distance between the inlet and outlet tubes. At least one infrared emitter and at least one infrared receiver are mounted on the tube member tube and are positioned to be opposed to each other such that the receiver will receive and detect light from the emitter. The emitter and receiver are operatively connected to a controller. The controller emits a signal when it is determined that the light from the emitter to the receiver is interrupted.

Abstract: A corner assembly for a tube conveyor system comprises a housing defining a wheel receiving area and a flow path defining an angle and having ports at opposite ends of said flow path. A wheel is rotatably received in the wheel receiving area. The wheel comprises a rim having an upper surface and a lower surface; at least one pair of spaced apart channels formed in at least one of the upper and lower surfaces of the rim; and at least one flapper pivotally mounted to said wheel inside of said rim. The flapper is freely movable between a first position in which the flapper is aligned with a wall of one of the channels and a second position in which the flapper is aligned with a wall of the other of the channels. Thus, when the wheel rotates, the flapper will sweep any material in the wheel receiving area towards and through one of the channels and into the flow path.

Abstract: An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a laser amplifier for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses.

Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.

Abstract: A system and method for inspecting machine readable marks on one side of a wafer without requiring transmission of radiant energy from another side of the wafer and through the wafer. The wafer has articles which may include die, chip scale packages, circuit patterns and the like. The marking occurs in a wafer marking system and within a designated region relative to an article position. The articles have a pattern on a first side. The method includes the steps of imaging a first side of the wafer, imaging a second side of the wafer, establishing correspondence between a portion of first side image and a portion of a second side image, and superimposing image data from the first and second sides to determine at least the position of a mark relative to an article.