Abstract: A dispense for dispensing an adhesive onto a remote surface, such as a case mouth and primer ammunition. The dispense includes a reservoir containing an adhesive; a positive displacement pump; and a nozzle having a tapered tip. The positive displacement pump delivers a predetermined amount of the adhesive, preferably an anaerobic adhesive, from the reservoir to the nozzle at predetermined intervals. The nozzle discharges the predetermined amount of adhesive through the air and at least 1/16-inch onto the remote surface.
Type:
Application
Filed:
August 9, 2013
Publication date:
August 27, 2015
Applicant:
Henkel Corporation
Inventors:
Steven J. Hemsen, Bryan DesRoches, Edward A.Y. Fisher
Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.
Type:
Grant
Filed:
March 18, 2013
Date of Patent:
November 11, 2014
Assignee:
Henkel Corporation
Inventors:
Anthony F. Jacobine, John G. Woods, Scott Senuta, David P. Dworak, Debora E. Duch, John Mazzullo
Abstract: The invention provides anaerobic curable compositions, and methods of their production and use. These compositions provide excellent adhesion especially on oily surfaces.
Abstract: The invention provides hot melt adhesives comprising (A) a mixture of polymers consisting of (1) an amorphous alpha olefin, (2) an ethylene copolymer that has a Tg value equal to or less than ?35° C.; and (3) a styrene block copolymer; and (B) a polyethylene wax grafted with a functional group. These hot melt adhesives have high heat resistance and good low temperature performance, making them particularly well suited for end-of-line packaging application.
Type:
Application
Filed:
March 12, 2013
Publication date:
September 18, 2014
Applicants:
Henkel Ltd., Henkel Corporation
Inventors:
Richard Ellis, Geetanjaliben Shah, Andrea Eodice
Abstract: This invention provides methods for controlled single electron transfer living radical polymerization (SET-LRP) of monomers with increased conversion, high molecular weights and low polydispersity by allowing the polymerization to proceed at low temperatures via a tubular reactor either made of copper or containing copper metal surface.
Type:
Application
Filed:
March 18, 2013
Publication date:
September 18, 2014
Applicant:
Henkel Corporation
Inventors:
Anthony F. Jacobine, John G. Woods, Scott Senuta, David P. Dworak, Debora E. Duch, John Mazzullo
Abstract: Oxetane-containing compounds, and compositions of oxetane-containing compounds together with carboxylic acids, latent carboxylic acids, and/or compounds having carboxylic acid and latent carboxylic acid functionality are provided. The oxetane-containing compounds and compositions thereof are useful as adhesives, sealants and encapsulants, particularly for components, and in the assembly, of LED devices.
Type:
Application
Filed:
March 15, 2013
Publication date:
September 18, 2014
Applicant:
Henkel Corporation
Inventors:
Puwei Liu, Donghang Xie, Emilie Barriau, Shengqian Kong
Abstract: The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.
Type:
Application
Filed:
March 12, 2013
Publication date:
September 18, 2014
Applicant:
HENKEL CORPORATION
Inventors:
Chuiwah Alice Cheung, Stephane Belmudes
Abstract: A curable adhesive composition comprising (i) 10 to 80 wt-% of a derivatives of cyanoacrylic esters, cyanopentadienoate esters, methyliden malonate esters (ii) 15 to 50 wt-% non-reactive (co)polymer(s) based on unsaturated monomers selected from vinyl esters or alkyl(meth)acrylates, iii) hydrocarbon resins and optionally iv) additives.
Abstract: An internal mold release agent (IMRA) which effectively releases a cured polyurethane (PU) material from a metal, in particular steel, mold. The IMRA is a surface active agent containing phosphorus or a combination (blend or reaction product) of the agent with other chemicals. In one embodiment the agent is a phosphate ester. In one embodiment the agent is polyoxyethylene alkyl phosphate ester. A polyurethane formulation comprising the IMRA has high formulation stability, clean release, low release strength, and high product transparency.
Type:
Application
Filed:
February 19, 2013
Publication date:
August 21, 2014
Applicants:
Henkel Corporation, Henkel AG & Co. KGaA
Inventors:
Qiwen Han, Andreas Ferencz, Olaf Lammerschop, Yongxia Wang
Abstract: The present invention relates to elastic attachment adhesives that comprise non-metallocene catalyzed polymers. The elastic attachment adhesives have stable creep performance under prolonged aging parameters, making these adhesives particularly well suited for elastic applications.
Type:
Application
Filed:
March 14, 2013
Publication date:
August 21, 2014
Applicant:
Henkel Corporation
Inventors:
Maria Cristina Barbosa DeJesus, Charles Paul, Valerie Alexis
Abstract: A semiconductor assembly comprises a semiconductor wafer, an adhesive coating disposed on the back side of the wafer, and a bare dicing tape, preferably UV radiation transparent. The assembly is prepared by the method comprising (a) providing a semiconductor wafer, (b) disposing a wafer back side coating on the semiconductor wafer, (c) partially curing the wafer back side coating to the extent that it adheres to the back side of the wafer and remains tacky, and (d) contacting the bare dicing tape to the partially cured and tacky wafer back side coating, optionally with heat and pressure.
Type:
Application
Filed:
March 15, 2013
Publication date:
August 14, 2014
Applicant:
HENKEL CORPORATION
Inventors:
Gyanendra Dutt, Qizhuo Zhuo, Elizabeth Hoang, Stephen Ruatta
Abstract: The present invention relates to thiol-ene curing compositions, which cure upon exposure to ultraviolet (UV) light and/or heat. The compositions include components having alkenyl (or “ene”) functionality and components having thiol functionality, which undergo thiol-ene curing. The compositions also include a cure system. More specifically, in some embodiments, the curable compositions include a vinyl polymer bearing alkenyl or thiol terminal functional group(s) and a cross-linking agent having the opposing functionality, i.e., thiol cross-linking agents with alkenyl-terminated vinyl polymers and vinyl cross-linking agents with thiol-terminated vinyl polymers. Also provided are methods of making and using the compositions, such as for sealants for in-place gasketing applications.
Type:
Application
Filed:
April 3, 2008
Publication date:
August 7, 2014
Applicants:
Henkel Corporation
Inventors:
John G. Woods, Richard O. Angus, JR., Joel D. Schall
Abstract: The present invention relates to photocurable elastomer compositions and methods of preparation and use of such compositions for cure-in-place applications such as gaskets. The curable compositions generally include an elastomer component, a monofunctional and/or multifunctional reactant and a photoinitiator that in various aspects may be a visible and/or UV curing initiator. The various components may be present in different amounts, depending on the combination of components and composition desired.
Type:
Application
Filed:
March 10, 2014
Publication date:
July 10, 2014
Applicant:
Henkel Corporation
Inventors:
James E. Lionberger, John G. Woods, Joel D. Schall
Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
Type:
Application
Filed:
March 14, 2013
Publication date:
May 22, 2014
Applicant:
Henkel Corporation
Inventors:
Tianjian Huang, Kristina Thompson, James Layser, John Harrington, John Meccia, Robert Mammerella
Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
Type:
Application
Filed:
March 14, 2013
Publication date:
May 8, 2014
Applicant:
Henkel Corporation
Inventors:
Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
Abstract: Living radical polymerization processes, reaction products of such processes, and compositions containing such reaction products are provided. More particularly, a living radical polymerization of (meth)acrylic acid monomers employing having a defined order of introduction of the reactants and/or a specific set of reaction conditions, is provided.
Type:
Application
Filed:
March 12, 2013
Publication date:
April 17, 2014
Applicant:
Henkel Corporation
Inventors:
Qinyan Zhu, David P. Dworak, John G. Woods, Anthony F. Jacobine