Abstract: Embodiments of the invention includes various power supplies for plasma systems. These power supplies, for example, closes a switch to connect and disconnect a current pathway to cause an application of an asymmetric periodic voltage waveform. Where each cycle of the asymmetric periodic voltage waveform includes a first portion that begins with a first negative voltage and changes to a positive peak voltage, a second portion that changes from the positive peak voltage to a third voltage level and a fourth portion that includes a negative voltage ramp from the third voltage level to a fourth voltage level.
Type:
Application
Filed:
April 29, 2025
Publication date:
August 14, 2025
Applicant:
Eagle Harbor Technologies Inc.
Inventors:
Timothy Ziemba, Kenneth Miller, James Prager
Abstract: A film forming apparatus configured to form a metal oxide film or a metal nitride film through atomic layer deposition by alternately introducing metal compound gas and an OH radical or an NH radical in a reaction container. The film forming apparatus including: the reaction container; and at least one plasma generator provided outside the reaction container and configured to generate a first plasma including an oxygen radical or a nitrogen radical when oxygen or nitrogen is supplied and generate a second plasma including a hydrogen radical when hydrogen is supplied. The OH radical is generated by collision between the oxygen radical and the hydrogen radical or the NH radical is generated by collision between the nitrogen radical and the hydrogen radical in a downstream region from an outlet of the at least one plasma generator to an inner space of the reaction container.
Abstract: Embodiments disclosed herein comprise an apparatus for sensing plasma conditions in a chamber. In an embodiment, the apparatus comprises a housing with a plasma sensor on a surface of the housing. In an embodiment, the apparatus further comprises a computing system within the housing and electrically coupled to the plasma sensor. In an embodiment, the computing system comprises a battery, a board, a processing unit on the board, and a memory coupled to the processing unit. In an embodiment, a wireless communication module may be coupled to the processing unit.
Type:
Application
Filed:
February 8, 2024
Publication date:
August 14, 2025
Inventors:
ANKE HELLMICH, AMIR BAYATI, CHRISTOPHER MALMS, LINDSAY HARDISON
Abstract: A method for repairing copper and low-k dielectric films on a substrate is provided. In some embodiments, the method includes positioning the substrate within a process chamber, introducing a reducing agent into the process chamber to remove copper oxide from a copper layer on the substrate, removing the reducing agent from the process chamber, and introducing a recovery precursor into the process chamber to decrease a k value of a low-k film on the substrate.
Type:
Application
Filed:
July 25, 2024
Publication date:
August 14, 2025
Inventors:
Xinyi LU, Kent Qiujing ZHAO, Bo XIE, Chi-I LANG, Chengen WANG, Chidambara A. RAMALINGAM, Li-Qun XIA, Shankar VENKATARAMAN
Abstract: Exemplary semiconductor processing methods may include providing a first etchant precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. A first layer of silicon-and-germanium-containing material, a second layer of silicon-and-germanium-containing material, and a layer of silicon-containing material may be disposed on the substrate. The methods may include providing a passivation precursor to the processing region. The methods may include contacting the substrate with the first etchant precursor and the passivation precursor. The contacting may selectively etch the first layer of silicon-and-germanium-containing material. The contacting may form a passivation material on the substrate.
Abstract: A pattern formation method includes: forming a first inversion layer on a projecting and recessed pattern of a curable composition; forming a flattened inversion layer as a second inversion layer on the first inversion layer; performing first etching of etching an upper layer portion of an inversion layer including the first inversion layer and the flattened inversion layer to expose a top surface of a projecting portion of the projecting and recessed pattern; and performing second etching of etching the exposed pattern of the curable composition using the inversion layer remaining in a recessed portion of the projecting and recessed pattern as a mask, and in the first etching, the first inversion layer and the flattened inversion layer are etched using mixed gas obtained by a plurality of kinds of etching gas.
Abstract: An apparatus for processing a substrate, suitable for use during semiconductor manufacturing is provided. The apparatus includes a chamber body, and a substrate support disposed within the chamber body. A plurality of upper lamps are disposed above the substrate support, and a plurality of lower lamps are disposed below the substrate support. One or more spot heaters are disposed above the substrate support, and are configured to direct a radiation beam towards the substrate support. The apparatus further includes a controller configured to control the one or more spot heaters. The controller is programmed to determine an angular position of the substrate and adjust a power output of one or more spot heaters using a set of temperature correction factors, such that the power output of the one or more spot heaters varies as the one or more spot heaters heat a plurality of angular portions of the substrate.
Abstract: A processing device for processing a workpiece includes: a holding table that holds the workpiece; a processing unit that performs processing on the workpiece held on the holding table; an abnormality detection unit that detects an abnormality of the workpiece; and a control unit that controls at least the processing unit and the abnormality detection unit. The control unit includes: a registration unit that registers first reference information serving as a reference for determining that the workpiece before processing is normal; and a comparison unit that compares the first reference information registered in the registration unit with first detection information obtained by detecting the workpiece by the abnormality detection unit before the workpiece is processed by the processing unit.
Abstract: Methods for forming improved isolation features in semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a method includes etching a first trench in a substrate; depositing a first insulation layer in the first trench with a first flowable chemical vapor deposition process; depositing a second insulation layer on the first insulation layer with a second flowable chemical vapor deposition process, the second flowable chemical vapor deposition process having process parameters different from the first flowable chemical vapor deposition process, and a portion of the first trench remaining unfilled by the first insulation layer and the second insulation layer; and forming an insulating fin in the portion of the first trench unfilled by the first insulation layer and the second insulation layer.
Abstract: A multilayer composite structure and a method of preparing a multilayer composite structure are provided. The multilayer composite structure comprises a semiconductor handle substrate having a minimum bulk region resistivity of at least about 500 ohm-cm and an isolation region that impedes the transfer of charge carriers along the surface of the handle substrate and reduces parasitic coupling between RF devices.
Abstract: The present technology includes methods and systems for forming advanced memory structures, and the resulting devices. Methods include forming a dielectric material layer over a first sidewall, a second sidewall, and a bottom wall, of one or more features, where the first sidewall is spaced apart from the second sidewall and the bottom wall is disposed between the first sidewall and the second sidewall. Methods include depositing a liner material directly on the dielectric material layer on the first sidewall, the second sidewall, and the bottom wall. Methods include removing at least a portion of the liner material from the bottom wall. Methods include selectively depositing a conductive material on a remaining portion of the liner material.
Type:
Application
Filed:
February 9, 2024
Publication date:
August 14, 2025
Applicant:
Applied Materials, Inc.
Inventors:
Zhijun Chen, Fredrick Fishburn, Raghuveer S. Makala, Balasubramanian Pranatharthiharan
Abstract: A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.
Abstract: An electronic device is formed by dispensing an underfill material around a perimeter of an integrated circuit (IC) chip bonded to a supporting substrate. A void in present in the underfill material that is present between the IC chip and the supporting substrate. An opening is present through at least one of the IC chip and the supporting substrate into communication with the void. A vacuum may be applied to the void through the opening that is present through the IC chip to reduce a size of the void to a first volume. The opening that is present through the IC chip is sealed with a sealing plate. The underfill material is cured after the sealing of the opening to reduce of the void to at least a second volume that is less than the first volume.
Abstract: A print control apparatus includes a hardware processor. The hardware processor receives a plurality of small jobs transmitted from a client terminal based on a print instruction, performs control to perform printing based on the received small jobs, accepts a job cancel instruction that is a printing terminate instruction or a printing interrupt instruction, and when the job cancel instruction is accepted during reception of the plurality of small jobs, performs control such that the printing based on the small jobs is terminated or interrupted.
Abstract: A non-transitory computer-readable storage medium storing a program configured to cause a computer of an information processing apparatus to function as: a change unit configured to, in accordance with a signal that is based on a user operation on a colorimeter, change a measurement mode related to color measurement performed by the colorimeter in color verification; and a notification unit configured to provide a notification indicating the change in the measurement mode made by the change unit.
Abstract: An inspection apparatus includes circuitry. The circuitry generates printing data from design data including a variable area and record information of variable input data. The circuitry inspects whether data read from the variable area of the printing data includes an error, based on the record information of the variable input data. The circuitry controls printing of the printing data in accordance with a result of inspecting the error.
Abstract: Remote access to the user interface of a mobile computer is carried out by simultaneous use of the screen broadcast function and the data reception functionality of the interface of peripheral input devices of this mobile computer to interact with a remote control computer via an IP network. Routing of mobile computer screen broadcast streams to the control computer can be carried out on a local network, e.g., through DHCP or mDNS (DNS-SD) services, and relaying to other networks through an appropriate proxy server. The conversion of IP manipulation data coming from the control computer to the mobile computer interface is carried out using a gateway with IP and HID interfaces. The invention can be implemented both on the basis of one device with Bluetooth HID or USB HID options, and on the basis of a local network of a mobile computer containing routers and gateways with appropriate properties.
Abstract: An audio reproduction system includes a serial bus configured to transmit audio data and control data using serial data communication, and to transmit low electric power; a zone computer connected to the serial bus and configured to provide audio data and control data to the serial bus; a low-power supply connected to the serial bus to supply the low electric power to the serial bus, the low electric power having a maximum value below a threshold; and a high-power supply configured to supply high electric power, the high electric power having a maximum value above the threshold. The system further includes a low-power active loudspeaker arrangement connected to the serial bus and configured to receive the audio data, control data and low electric power over the serial bus. The system further includes a high-power active loudspeaker arrangement connected to the serial bus and a second power supply.
Abstract: An adder and a method for calculating 2n+x are provided, where x is a variable input expressed in a floating point format and n is an integer. The adder comprises a first path configured to calculate 2n+x for x<0 and 2n?1?|x|<2n+1; a second path configured to calculate 2n+x for |x|<2n; a third path configured to calculate 2n+x for |x|?2n; and selection logic configured to cause the adder to output a result from one of the first, second, and third paths in dependence on the values of x and n.
Abstract: An example operation includes one or more of detecting, by a transport, a difference between sensor data associated with a location outside the transport and data stored on the transport and updating, by the transport, the data stored on the transport with the difference.